Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | ENPP2 | Q13822 | 7/20 | 0.46 |
| ▸ | LPAR2 | Q9HBW0 | 3/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5613457 | 0.94 | ALDH1A1 (0.50) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL8164123 | 0.93 | ALDH1A1 (0.53) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL8804713 | 0.93 | ALDH1A1 (0.53) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL12413472 | 0.91 | SMN1; SMN2 (0.46) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL1977826 | 0.88 | SMN1; SMN2 (0.44) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL31259322 | 0.81 | SMN1; SMN2 (0.47) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL1980412 | 0.79 | TSHR (0.48) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL27572151 | 0.79 | SMN1; SMN2 (0.53) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL1978868 | 0.76 | CYP3A4 (0.63) | SMN1; SMN2ALDH1A1TDP1ENPP2LPAR2 | |
| SCHEMBL777137 | 0.76 | CYP1A2 (0.41) | SMN1; SMN2TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20050239975-A1 | Halogen free ignition resistant thermoplastic resin compositions | GAN JOSEPH | 2005-10-27 | — | — | US | claimed |
| EP-1513890-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2005-03-16 | — | — | EP | claimed |
| WO-2003102060-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES, INC. (US) | 2003-12-11 | — | — | WO | claimed |
| EP-2927278-B1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2021-09-15 | — | — | EP | disclosed |
| US-10178767-B2 | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-01-08 | — | — | US | disclosed |
| EP-2710068-B1 | ALUMINUM PHOSPHORUS ACID SALTS AS EPOXY RESIN CURE INHIBITORS | CHEMTURA CORP (US) | 2015-11-18 | — | — | EP | disclosed |
| US-20150319853-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, METALLIC FOIL CLAD LAMINATE, AND PRINTED CIRCUIT BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-11-05 | — | — | US | disclosed |
| EP-2927278-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-10-07 | — | — | EP | disclosed |
| US-9145488-B2 | Aluminum phosphorus acid salts as epoxy resin cure inhibitors | CHEMTURA CORPORATION (US) | 2015-09-29 | — | — | US | disclosed |
| US-9006312-B2 | Composite compositions | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-04-14 | — | — | US | disclosed |
| EP-2710068-A1 | ALUMINUM PHOSPHORUS ACID SALTS AS EPOXY RESIN CURE INHIBITORS | Chemtura Corporation (US) | 2014-03-26 | — | — | EP | disclosed |
| WO-2003102060-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES, INC. (US) | 2003-12-11 | — | — | WO | disclosed |
| US-6645631-B2 | Mixture containing phosphorous compound | DOW GLOBAL TECHNOLOGIES INC. | 2003-11-11 | — | — | US | disclosed |
| US-20030031873-A1 | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith | BLUE CUBE IP LLC | 2003-02-13 | — | — | US | disclosed |
| EP-1268665-A1 | FLAME RETARDANT PHOSPHORUS ELEMENT-CONTAINING EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2003-01-02 | — | — | EP | disclosed |
| US-20020119317-A1 | Mixture containing phosphorous compound | BLUE CUBE IP LLC | 2002-08-29 | — | — | US | disclosed |
| WO-2001042359-A1 | FLAME RETARDANT PHOSPHORUS ELEMENT-CONTAINING EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2001-06-14 | — | — | WO | disclosed |
| US-6201074-B1 | PHOSPHOROUS DIEPOXIDES FOR EPOXY RESINS | SIEMENS AKTIENGESELLSCHAFT (DE) | 2001-03-13 | — | — | US | disclosed |
| US-5376453-A | Nonflammable moldings with high glass transition temperature | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-12-27 | — | — | US | disclosed |
| US-5364893-A | Hydrogenated aromatic diisocyanate trimer curing agent | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-11-15 | — | — | US | disclosed |