Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.48 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.41 |
| ▸ | ENPP2 | Q13822 | 7/20 | 0.40 |
| ▸ | LPAR2 | Q9HBW0 | 3/20 | 0.40 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | GLA | P06280 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10429188 | 0.94 | TSHR (0.60) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL16395878 | 0.83 | ALDH1A1 (0.39) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL1977826 | 0.83 | SMN1; SMN2 (0.44) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL7934132 | 0.82 | SMN1; SMN2 (0.42) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL7941659 | 0.82 | SMN1; SMN2 (0.42) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL27496366 | 0.79 | TSHR (0.41) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL1980600 | 0.79 | SMN1; SMN2 (0.50) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL5613457 | 0.78 | ALDH1A1 (0.50) | SMN1; SMN2ALDH1A1ENPP2LPAR2TDP1 | |
| SCHEMBL4432272 | 0.77 | ALDH1A1 (0.38) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 | |
| SCHEMBL9846772 | 0.77 | SMN1; SMN2 (0.43) | TSHRSMN1; SMN2ALDH1A1ENPP2LPAR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20050239975-A1 | Halogen free ignition resistant thermoplastic resin compositions | GAN JOSEPH | 2005-10-27 | — | — | US | claimed |
| EP-1513890-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2005-03-16 | — | — | EP | claimed |
| WO-2003102060-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES, INC. (US) | 2003-12-11 | — | — | WO | claimed |
| EP-2927278-B1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2021-09-15 | — | — | EP | disclosed |
| US-10178767-B2 | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-01-08 | — | — | US | disclosed |
| EP-2710068-B1 | ALUMINUM PHOSPHORUS ACID SALTS AS EPOXY RESIN CURE INHIBITORS | CHEMTURA CORP (US) | 2015-11-18 | — | — | EP | disclosed |
| US-20150319853-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, METALLIC FOIL CLAD LAMINATE, AND PRINTED CIRCUIT BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-11-05 | — | — | US | disclosed |
| EP-2927278-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-10-07 | — | — | EP | disclosed |
| US-9145488-B2 | Aluminum phosphorus acid salts as epoxy resin cure inhibitors | CHEMTURA CORPORATION (US) | 2015-09-29 | — | — | US | disclosed |
| US-9006312-B2 | Composite compositions | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-04-14 | — | — | US | disclosed |
| US-20120296013-A1 | Aluminum Phosphorus Acid Salts as Epoxy Resin Cure Inhibitors | CHEMTURA CORPORATION (US) | 2012-11-22 | — | — | US | disclosed |
| WO-2003102060-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES, INC. (US) | 2003-12-11 | — | — | WO | disclosed |
| US-6645631-B2 | Mixture containing phosphorous compound | DOW GLOBAL TECHNOLOGIES INC. | 2003-11-11 | — | — | US | disclosed |
| US-20030031873-A1 | Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith | BLUE CUBE IP LLC | 2003-02-13 | — | — | US | disclosed |
| EP-1268665-A1 | FLAME RETARDANT PHOSPHORUS ELEMENT-CONTAINING EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2003-01-02 | — | — | EP | disclosed |
| US-20020119317-A1 | Mixture containing phosphorous compound | BLUE CUBE IP LLC | 2002-08-29 | — | — | US | disclosed |
| WO-2001042359-A1 | FLAME RETARDANT PHOSPHORUS ELEMENT-CONTAINING EPOXY RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2001-06-14 | — | — | WO | disclosed |
| US-6201074-B1 | PHOSPHOROUS DIEPOXIDES FOR EPOXY RESINS | SIEMENS AKTIENGESELLSCHAFT (DE) | 2001-03-13 | — | — | US | disclosed |
| US-5376453-A | Nonflammable moldings with high glass transition temperature | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-12-27 | — | — | US | disclosed |
| US-5364893-A | Hydrogenated aromatic diisocyanate trimer curing agent | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-11-15 | — | — | US | disclosed |