SCHEMBL19822471

SCHEMBL19822471

CO[Si](CCCNC(=S)Nc1ccccn1)(OC)OC

nearest known ligand 0.69

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.69
ALOX12 P18054 5/20 0.61
ALDH1A1 P00352 4/20 0.61
KDM4E B2RXH2 2/20 0.61
RAB9A P51151 7/20 0.59
QPCT Q16769 1/20 0.56
NPC1 O15118 6/20 0.54
SMN1; SMN2 Q16637 5/20 0.54
NPSR1 Q6W5P4 3/20 0.54
KMT2A Q03164 2/20 0.54
LMNA P02545 3/20 0.53
ACHE P22303 1/20 0.51
MAPT P10636 1/20 0.49
HTT P42858 1/20 0.49
PKM P14618 1/20 0.48
MEN1 O00255 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17030410 0.84 SMN1; SMN2 (0.71) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL31243348 0.84 SMN1; SMN2 (0.71) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL5452460 0.83 SMN1; SMN2 (0.69) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL19822481 0.80 ALDH1A1 (0.59) POLBALOX12ALDH1A1RAB9AQPCT
SCHEMBL11488553 0.80 ALDH1A1 (0.71) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL4402140 0.80 ALDH1A1 (0.63) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL11839412 0.78 ALDH1A1 (0.70) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL6954647 0.78 POLB (0.64) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL6964982 0.78 ALDH1A1 (0.74) POLBALOX12ALDH1A1KDM4ERAB9A
SCHEMBL6964410 0.78 POLB (0.64) POLBALOX12ALDH1A1KDM4ERAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed