Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.95 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.95 |
| ▸ | TEAD4 | Q15561 | 1/20 | 0.71 |
| ▸ | MAPT | P10636 | 5/20 | 0.68 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.68 |
| ▸ | POLB | P06746 | 1/20 | 0.68 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.64 |
| ▸ | TSHR | P16473 | 1/20 | 0.64 |
| ▸ | MEN1 | O00255 | 2/20 | 0.61 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.61 |
| ▸ | MITF | O75030 | 1/20 | 0.61 |
| ▸ | GAA | P10253 | 1/20 | 0.61 |
| ▸ | GFER | P55789 | 1/20 | 0.61 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.61 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.61 |
| ▸ | NPC1 | O15118 | 3/20 | 0.59 |
| ▸ | RAB9A | P51151 | 3/20 | 0.59 |
| ▸ | NLRP3 | Q96P20 | 1/20 | 0.59 |
| ▸ | MAOA | P21397 | 2/20 | 0.54 |
| ▸ | MAOB | P27338 | 1/20 | 0.52 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17865520 | 0.98 | ALDH1A1 (1.00) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL7189792 | 0.91 | ALDH1A1 (0.88) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL19697573 | 0.91 | TEAD4 (0.86) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL9352887 | 0.88 | ALDH1A1 (0.81) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL30063 | 0.88 | ALDH1A1 (0.82) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL19835480 | 0.86 | ALDH1A1 (0.93) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL12607298 | 0.83 | TEAD4 (1.00) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL5608812 | 0.83 | ALDH1A1 (0.74) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL13018332 | 0.83 | TEAD4 (1.00) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 | |
| SCHEMBL23759 | 0.83 | MEN1 (0.79) | ALDH1A1SMN1; SMN2TEAD4MAPTTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4029690-B1 | METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2026-04-22 | — | — | EP | disclosed |
| WO-2025070797-A1 | COPOLYMER, RESIN BASE MATERIAL, RESIN COMPOSITION, COATING LIQUID, POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, AND MANUFACTURING METHOD | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025070767-A1 | RESIN COMPOSITION, COATING SOLUTION, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| CN-118772377-A | Urea epoxy curing accelerator, epoxy conductive silver adhesive and preparation method | 汉方新材料科技(嘉善)有限公司 | 2024-10-15 | — | — | CN | disclosed |
| US-20240228705-A1 | RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2024-07-11 | — | — | US | disclosed |
| US-20240166817-A1 | RESIN COMPOSITION | NAN YA PLASTICS CORPORATION (TW) | 2024-05-23 | — | — | US | disclosed |
| WO-2024071066-A1 | METAL-CLAD LAMINATED PLATE | 日鉄ケミカル＆マテリアル株式会社 | 2024-04-04 | — | — | WO | disclosed |
| US-11873389-B2 | Composition and molded article | AKITA UNIVERSITY (JP) | 2024-01-16 | — | — | US | disclosed |
| US-20230279226-A1 | POLYIMIDE RESIN | NAN YA PLASTICS CORPORATION (TW) | 2023-09-07 | — | — | US | disclosed |
| CN-115891346-A | Metal-clad laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2023-04-04 | — | — | CN | disclosed |
| EP-4029690-A1 | METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME | NIPPON STEEL Chemical & Material Co., Ltd. (JP) | 2022-07-20 | — | — | EP | disclosed |
| US-20220073722-A1 | COMPOSITION AND MOLDED ARTICLE | AKITA UNIVERSITY (JP) | 2022-03-10 | — | — | US | disclosed |
| US-10844175-B2 | Polyamide acid, thermoplastic polyimide, resin film, metal-clad laminate and circuit board | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2020-11-24 | — | — | US | disclosed |
| US-20190100624-A1 | POLYAMIDE ACID, THERMOPLASTIC POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE AND CIRCUIT BOARD | NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) | 2019-04-04 | — | — | US | disclosed |
| US-20180030246-A1 | COMPOSITION AND MOLDED ARTICLE | AKITA UNIVERSITY (JP) | 2018-02-01 | — | — | US | disclosed |