SCHEMBL19901205

SCHEMBL19901205

CCO[Si](CCCNC(=O)Oc1ccc(C(c2ccc(OCC3CO3)cc2)C(c2ccc(OCC3CO3)cc2)c2ccc(OCC3CO3)cc2)cc1)(OCC)OCC

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 8/20 0.42
SMN1; SMN2 Q16637 1/20 0.39
TP53 P04637 2/20 0.36
MAPT P10636 2/20 0.36
HPGD P15428 2/20 0.36
TSHR P16473 2/20 0.36
ALDH1A1 P00352 2/20 0.36
MEN1 O00255 1/20 0.36
CYP1A2 P05177 1/20 0.36
KMT2A Q03164 1/20 0.36
PPARG P37231 1/20 0.36
HIF1A Q16665 1/20 0.36
LMNA P02545 1/20 0.36
GAA P10253 1/20 0.36
PKM P14618 1/20 0.36
BCHE P06276 1/20 0.36
LIPE Q05469 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16640964 0.97 MGLL (0.47) MGLLSMN1; SMN2BCHELIPE
SCHEMBL19901207 0.95 MGLL (0.39) MGLLSMN1; SMN2TP53MAPTHPGD
SCHEMBL19901206 0.95 MGLL (0.39) MGLLSMN1; SMN2TP53MAPTHPGD
SCHEMBL16640989 0.94 MGLL (0.42) MGLLSMN1; SMN2TP53MAPTHPGD
SCHEMBL16640963 0.88 MGLL (0.55) MGLLSMN1; SMN2BCHELIPE
SCHEMBL16640950 0.88 MGLL (0.55) MGLLSMN1; SMN2BCHELIPE
SCHEMBL16640936 0.88 MGLL (0.55) MGLLSMN1; SMN2BCHELIPE
SCHEMBL16644935 0.88 MGLL (0.55) MGLLSMN1; SMN2BCHELIPE
SCHEMBL16919338 0.87 ALDH1A1 (0.54) MGLLSMN1; SMN2TP53MAPTHPGD
SCHEMBL16641010 0.83 MGLL (0.50) MGLLSMN1; SMN2BCHELIPE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 US disclosed