SCHEMBL19901773

SCHEMBL19901773

C=CCOc1ccc(C(c2ccc(OCC3CO3)cc2)C(c2ccc(OCC3CO3)cc2)c2ccc(OC3CCO3)cc2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.42
TP53 P04637 3/20 0.42
TSHR P16473 3/20 0.42
MAPT P10636 3/20 0.42
HPGD P15428 2/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
HIF1A Q16665 2/20 0.42
CYP1A2 P05177 1/20 0.42
PPARG P37231 1/20 0.42
TDP1 Q9NUW8 1/20 0.40
PKM P14618 2/20 0.39
LMNA P02545 1/20 0.39
GAA P10253 1/20 0.39
SMN1; SMN2 Q16637 3/20 0.37
CYP3A4 P08684 1/20 0.37
NPC1 O15118 3/20 0.36
RAB9A P51151 3/20 0.36
GPR84 Q9NQS5 3/20 0.34
CA12 O43570 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20909608 0.90 ALDH1A1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL21203083 0.90 ALDH1A1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL19325467 0.90 ALDH1A1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL19901808 0.89 TDP1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL16641004 0.89 TDP1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL19901811 0.84 ALDH1A1 (0.45) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL20129367 0.83 MAPT (0.43) ALDH1A1TP53TSHRMAPTMEN1
SCHEMBL23919673 0.82 ALDH1A1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL19227251 0.82 ALDH1A1 (0.50) ALDH1A1TP53TSHRMAPTHPGD
SCHEMBL23450562 0.82 ALDH1A1 (0.50) ALDH1A1TP53TSHRMAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902803-B2 Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-02-27 US disclosed