Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ZDHHC20 | Q5W0Z9 | 1/20 | 0.53 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.44 |
| ▸ | TSHR | P16473 | 3/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | TGM2 | P21980 | 2/20 | 0.39 |
| ▸ | GAA | P10253 | 2/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 2/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3109503 | 0.89 | ALDH1A1 (0.56) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL25521272 | 0.89 | ZDHHC20 (0.53) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL763022 | 0.89 | ZDHHC20 (0.47) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL22840975 | 0.86 | TSHR (0.50) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL15362263 | 0.85 | ZDHHC20 (0.53) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL2608231 | 0.84 | ZDHHC20 (0.56) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL2608229 | 0.83 | ZDHHC20 (0.59) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL26478818 | 0.82 | ZDHHC20 (0.53) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL12964741 | 0.81 | ZDHHC20 (0.45) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 | |
| SCHEMBL21505428 | 0.81 | ZDHHC20 (0.41) | ZDHHC20ZDHHC2ALDH1A1TSHRMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8716413-B2 | Photocurable composition | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2014-05-06 | — | — | US | disclosed |
| US-20110200950-A1 | PHOTOCURABLE COMPOSITION | HUNTSMAN INTERNATIONAL LLC (US) | 2011-08-18 | — | — | US | disclosed |
| EP-2331599-A1 | PHOTOCURABLE COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2011-06-15 | — | — | EP | disclosed |
| WO-2010034531-A1 | PHOTOCURABLE COMPOSITION | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2010-04-01 | — | — | WO | disclosed |
| EP-2168994-A1 | Photocurable composition | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2010-03-31 | — | — | EP | disclosed |
| EP-1651695-B1 | PHOTOCROSSLINKABLE POLYURETHANES | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2009-01-21 | — | — | EP | disclosed |
| US-7476484-B2 | Photocrosslinkable polyurethanes | HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (US) | 2009-01-13 | — | — | US | disclosed |
| US-7387812-B2 | Telechelic polymers; improved adhesion properties, chemical stability, electrical properties and resistance to rapid temperature ranges; for use as solder resists in production of circuit boards | HUNTSMAN ADVANCED MATERIALS AMERICAS INC. (US) | 2008-06-17 | — | — | US | disclosed |
| EP-1468041-B1 | RESIN COMPOSITION | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2007-05-30 | — | — | EP | disclosed |
| US-20060204895-A1 | Photocrosslinkable polyurethanes | HUNTSMAN ADVANCED MATERIALS AMERICA INC. (US) | 2006-09-14 | — | — | US | disclosed |
| EP-1651695-A1 | PHOTOCROSSLINKABLE POLYURETHANES | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2006-05-03 | — | — | EP | disclosed |
| EP-1458794-B1 | HEAT-CURABLE RESIN COMPOSITION | HUNTSMAN ADV MAT SWITZERLAND (CH) | 2005-08-17 | — | — | EP | disclosed |
| WO-2005014682-A1 | PHOTOCROSSLINKABLE POLYURETHANES | HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) | 2005-02-17 | — | — | WO | disclosed |
| US-20050032935-A1 | Telechelic polymers; improved adhesion properties, chemical stability, electrical properties and resistance to rapid temperature ranges; for use as solder resists in production of circuit boards | HUNTSMAN ADVANCED MATERIALS AMERICAS, INC. | 2005-02-10 | — | — | US | disclosed |
| US-20050032946-A1 | Resin composition | HUNTSMAN ADVANCED MATERIALS AMERICAS, INC. (US) | 2005-02-10 | — | — | US | disclosed |
| EP-1468041-A1 | RESIN COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2004-10-20 | — | — | EP | disclosed |
| EP-1458794-A1 | HEAT-CURABLE RESIN COMPOSITION | Huntsman Advanced Materials (Switzerland) GmbH (CH) | 2004-09-22 | — | — | EP | disclosed |
| WO-2003048235-A1 | HEAT-CURABLE RESIN COMPOSITION | VANTICO AG (CH) | 2003-06-12 | — | — | WO | disclosed |
| WO-2003048234-A1 | RESIN COMPOSITION | VANTICO AG (CH) | 2003-06-12 | — | — | WO | disclosed |