SCHEMBL19965858

SCHEMBL19965858

CC(C)(C)C1C(=O)N(c2ccccc2)C(=O)C1C(C)(C)C(C)(C)C1C2CCC(C2)C1C(C)(C)C

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.47
KMT2A Q03164 1/20 0.47
POLB P06746 2/20 0.38
ALDH1A1 P00352 6/20 0.37
HPGD P15428 1/20 0.37
NPC1 O15118 1/20 0.37
RAB9A P51151 1/20 0.37
LMNA P02545 1/20 0.36
ALOX15 P16050 1/20 0.35
TSHR P16473 1/20 0.35
MT-CO2 P00403 2/20 0.35
ALOX5 P09917 2/20 0.35
CACNA1B Q00975 1/20 0.35
APBA1 Q02410 1/20 0.35
ATM Q13315 1/20 0.34
MAPT P10636 1/20 0.33
GAA P10253 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18534249 0.78 MEN1 (0.50) MEN1KMT2APOLBALDH1A1LMNA
SCHEMBL23334382 0.74 CACNA1B (0.46) MEN1KMT2APOLBALDH1A1ALOX15
SCHEMBL10038045 0.69 MEN1 (0.85) MEN1KMT2APOLBALDH1A1HPGD
SCHEMBL18830966 0.69 MEN1 (0.85) MEN1KMT2APOLBALDH1A1HPGD
SCHEMBL19072674 0.64 MAPT (0.34) MEN1KMT2APOLBALDH1A1LMNA
SCHEMBL19881345 0.64 CACNA1B (0.45) MEN1KMT2APOLBALDH1A1NPC1
SCHEMBL25771053 0.63 ATM (0.54) MEN1KMT2APOLBALDH1A1HPGD
SCHEMBL22209663 0.63 BPTF (0.53) MEN1KMT2APOLBNPC1RAB9A
SCHEMBL19965939 0.63 ELANE (0.37) POLBALDH1A1HPGDNPC1RAB9A
SCHEMBL21577183 0.62 MGLL (0.50) MEN1KMT2AALDH1A1HPGDRAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10174229-B2 Adhesive resins for wafer bonding INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2019-01-08 US disclosed
US-20180072926-A1 ADHESIVE RESINS FOR WAFER BONDING INTERNATIONAL BUSINESS MACHINES CORPORATION 2018-03-15 US disclosed