SCHEMBL19971067

SCHEMBL19971067

O=C(O)C1(CC2CO2)CC2OC2CC1(CC1CO1)C(=O)O

nearest known ligand 0.31

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 2/20 0.31
TP53 P04637 2/20 0.31
NFKB1 P19838 2/20 0.31
THPO P40225 2/20 0.31
GMNN O75496 2/20 0.31
LMNA P02545 2/20 0.31
PMP22 Q01453 2/20 0.31
CYP2C19 P33261 1/20 0.31
STAT6 P42226 1/20 0.31
HIF1A Q16665 1/20 0.31
NPC1 O15118 1/20 0.31
MTOR P42345 1/20 0.31
RAB9A P51151 1/20 0.31
BLM P54132 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
KDM4E B2RXH2 1/20 0.30
TFPI2 P48307 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL420671 0.78 TP53 (0.33) MAPK1TP53NFKB1THPOGMNN
SCHEMBL29273941 0.78 ALDH1A1 (0.40) TP53
SCHEMBL157692 0.76 CYP2C19 (0.33) TP53CYP2C19
SCHEMBL4879516 0.74
SCHEMBL20913174 0.74 MAPK1 (0.31) MAPK1TP53NFKB1THPOGMNN
SCHEMBL11866220 0.74 MAPK1 (0.39) MAPK1TP53NFKB1THPOGMNN
SCHEMBL4601279 0.74 MAPK1 (0.39) MAPK1TP53NFKB1THPOGMNN
SCHEMBL27901413 0.72
SCHEMBL16390469 0.72 GMNN (0.34) MAPK1TP53NFKB1THPOGMNN
SCHEMBL27383022 0.68 ALDH1A1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108026248-B Thermosetting epoxy resin compositions for making outdoor articles and articles obtained therefrom 亨斯迈先进材料许可(瑞士)有限公司 2021-12-10 CN claimed
EP-3317318-B1 A THERMOSETTING EPOXY RESIN COMPOSITION FOR THE PREPARATION OF OUTDOOR ARTICLES, AND THE ARTICLES OBTAINED THEREFROM HUNTSMAN ADV MAT LICENSING SWITZERLAND GMBH (CH) 2019-04-24 EP claimed
US-20180371153-A1 A Thermosetting Epoxy Resin Composition for the Preparation of Outdoor Articles, and the Articles Obtained Therefrom HUNTSMAN INTERNATIONAL LLC 2018-12-27 US claimed
CN-114937518-B Low-temperature curing conductive silver paste for HJT high-efficiency battery and preparation method thereof 无锡帝科电子材料股份有限公司 2024-10-29 CN disclosed
CN-115521395-B Solvent precipitation polymerization preparation method of chloroether resin and chloroether resin thereof 杭州电化集团有限公司 2024-07-26 CN disclosed
CN-115368857-B Anti-cracking low-halogen high-transparency epoxy resin sealing adhesive 书香门地集团股份有限公司 2024-07-05 CN disclosed
CN-117839732-A Multi-element homogeneous heteropolyacid catalyst and preparation method and application thereof 中国石油化工股份有限公司 2024-04-09 CN disclosed
CN-117757221-A Epoxy resin system, epoxy resin material, preparation method of epoxy resin system and IV-type hydrogen storage cylinder 中国石油化工股份有限公司 2024-03-26 CN disclosed
CN-114163613-B Packaging material, preparation method and application thereof 北京科化新材料科技有限公司 2024-03-12 CN disclosed
CN-117304138-A Method for preparing epoxy compound by using micro-flux continuous flow reactor 江苏泰特尔新材料科技股份有限公司 2023-12-29 CN disclosed
CN-117264217-A Modified alicyclic epoxy resin and modification method thereof 信之高新材料(浙江)有限公司 2023-12-22 CN disclosed
CN-117186817-A Novel epoxy structural adhesive film for medium-temperature curing and high-temperature use and preparation method thereof 航天材料及工艺研究所 2023-12-08 CN disclosed
CN-117165233-A Modified epoxy adhesive and preparation method and application thereof 深圳市安伯斯科技有限公司 2023-12-05 CN disclosed
CN-115960302-B Acrylic acid ester copolymer, pressure-sensitive adhesive composition, pressure-sensitive adhesive and pressure-sensitive adhesive product 江苏皇冠新材料科技有限公司 2023-06-13 CN disclosed
CN-116200154-A Epoxy resin adhesive for gas separation membrane assembly and preparation method thereof 大连欧科膜技术工程有限公司 2023-06-02 CN disclosed
CN-108026248-B Thermosetting epoxy resin compositions for making outdoor articles and articles obtained therefrom 亨斯迈先进材料许可(瑞士)有限公司 2021-12-10 CN disclosed
EP-3296340-B1 CURABLE EPOXY RESIN FORMULATION, METHOD FOR MANUFACTURING A MATERIAL USING SAID FORMULATION AND USES THEREOF SCHNEIDER ELECTRIC IND SAS (FR) 2019-08-14 EP disclosed
EP-3317318-B1 A THERMOSETTING EPOXY RESIN COMPOSITION FOR THE PREPARATION OF OUTDOOR ARTICLES, AND THE ARTICLES OBTAINED THEREFROM HUNTSMAN ADV MAT LICENSING SWITZERLAND GMBH (CH) 2019-04-24 EP disclosed
US-20180371153-A1 A Thermosetting Epoxy Resin Composition for the Preparation of Outdoor Articles, and the Articles Obtained Therefrom HUNTSMAN INTERNATIONAL LLC 2018-12-27 US disclosed
EP-3296340-A1 CURABLE EPOXY RESIN FORMULATION, METHOD FOR MANUFACTURING A MATERIAL USING SAID FORMULATION AND USES THEREOF Schneider Electric Industries SAS (FR) 2018-03-21 EP disclosed