SCHEMBL20052302

SCHEMBL20052302

CC(O)COc1ccc(C(C)(C)c2ccc(OC(C)(C)C)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 2/20 0.54
HTT P42858 2/20 0.54
AR P10275 2/20 0.52
LMNA P02545 2/20 0.51
KMT2A Q03164 4/20 0.45
KDM4E B2RXH2 4/20 0.42
ALDH1A1 P00352 3/20 0.42
MAPT P10636 3/20 0.41
MEN1 O00255 3/20 0.41
TP53 P04637 2/20 0.41
HPGD P15428 2/20 0.41
TSHR P16473 2/20 0.41
CYP1A2 P05177 1/20 0.41
PPARG P37231 1/20 0.41
TDP1 Q9NUW8 1/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
GAA P10253 2/20 0.39
PSMB1 P20618 1/20 0.38
PSMB5 P28074 1/20 0.38
PSMB2 P49721 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL376300 0.92 HIF1A (0.61) HIF1AHTTARLMNAKMT2A
SCHEMBL13851882 0.87 HTT (0.65) HIF1AHTTARLMNAKMT2A
SCHEMBL17702714 0.87 HIF1A (0.56) HIF1AHTTARLMNAKMT2A
SCHEMBL13827069 0.86 HIF1A (0.52) HIF1AHTTARKMT2AKDM4E
SCHEMBL13892365 0.85 HIF1A (0.55) HIF1AHTTARLMNAKMT2A
SCHEMBL823191 0.85 HIF1A (0.55) HIF1AHTTARLMNAKMT2A
SCHEMBL19757595 0.85 HIF1A (0.55) HIF1AHTTARLMNAKMT2A
SCHEMBL11330136 0.85 LMNA (0.68) HIF1AHTTARLMNAKMT2A
SCHEMBL23992613 0.84 HTT (0.54) HIF1AHTTARLMNAKMT2A
SCHEMBL18473698 0.83 HTT (0.57) HIF1AHTTARLMNAKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9947567-B2 Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2018-04-17 US disclosed