SCHEMBL2006296

SCHEMBL2006296

[N-3].[N-3].[N-3].[N-3].[N-3].[SiH4].[SiH4].[SiH4].[Ta+5].[Ta+5].[Ta+5]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2030926 1.00
SCHEMBL379794 1.00
SCHEMBL7104338 0.87
SCHEMBL4918399 0.87
SCHEMBL7600553 0.87
SCHEMBL9130772 0.87
SCHEMBL5615282 0.87
SCHEMBL33275 0.82
SCHEMBL3467470 0.82
SCHEMBL2443636 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112602191-B Capacitor and manufacturing method thereof 深圳市汇顶科技股份有限公司 2022-12-23 CN claimed
CN-112928116-A Ferroelectric memory 财团法人工业技术研究院 2021-06-08 CN claimed
CN-112602191-A Capacitor and manufacturing method thereof 深圳市汇顶科技股份有限公司 2021-04-02 CN claimed
CN-102800631-B Method for forming complementary metal oxide semiconductor (CMOS) transistor SEMICONDUCTOR MFG INT SHANGHAI 2014-09-03 CN claimed
CN-102800631-A Method for forming complementary metal oxide semiconductor (CMOS) transistor SEMICONDUCTOR MFG INT SHANGHAI 2012-11-28 CN claimed
CN-100456513-C Phase changeable memory cells and methods of forming the same SAMSUNG ELECTRONICS CO LTD (KR) 2009-01-28 CN claimed
CN-1272857-C Grid structure with independently made vertical doped distributions IBM (US) 2006-08-30 CN claimed
CN-1808736-A Phase changeable memory cells and methods of forming the same SAMSUNG ELECTRONICS CO LTD (KR) 2006-07-26 CN claimed
CN-1503374-A Grid structure with independently made vertical doped distributions �Ҵ���˾ 2004-06-09 CN claimed
JP-10284440-A None JP disclosed
US-20240162382-A1 LIGHT-EMITTING PACKAGE AND LIGHT-EMITTING ELEMENT EPISTAR CORPORATION (TW) 2024-05-16 US disclosed
EP-4113626-A1 GATE-ALL-AROUND TRANSISTOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE Huawei Technologies Co., Ltd. (CN) 2023-01-04 EP disclosed
CN-112602191-B Capacitor and manufacturing method thereof 深圳市汇顶科技股份有限公司 2022-12-23 CN disclosed
US-20220406907-A1 METALLIC SEALANTS IN TRANSISTOR ARRANGEMENTS INTEL CORPORATION (US) 2022-12-22 US disclosed
US-20030155585-A1 Semiconductor device and liquid jet apparatus using the same CANON KABUSHIKI KAISHA (JP) 2003-08-21 US disclosed
US-20020125511-A1 Semiconductor device, method of manufacturing the same and liquid jet apparatus CANON KABUSHIKI KAISHA (JP) 2002-09-12 US disclosed
EP-1233452-A2 Semiconductor device, method of manufacturing the same and liquid jet apparatus CANON KABUSHIKI KAISHA (JP) 2002-08-21 EP disclosed
JP-2000260959-A IRIDIUM CONDUCTIVE ELECTRODE/BARRIER STRUCTURE AND FORMATION THEREOF SHARP CORP 2000-09-22 JP disclosed
JP-2000091341-A PROCESSING FOR COPPER-BONDED PAD TEXAS INSTR INC <TI> 2000-03-31 JP disclosed
JP-H10284440-A MANUFACTURE OF SEMICONDUCTOR DEVICE MOTOROLA INC 1998-10-23 JP disclosed