⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3467470 | 1.00 | — | — | |
| SCHEMBL4368546 | 0.82 | — | — | |
| SCHEMBL1401574 | 0.82 | — | — | |
| SCHEMBL1002726 | 0.82 | — | — | |
| SCHEMBL5434695 | 0.82 | — | — | |
| SCHEMBL391163 | 0.82 | — | — | |
| SCHEMBL4913395 | 0.82 | — | — | |
| SCHEMBL1796527 | 0.82 | — | — | |
| SCHEMBL2539870 | 0.82 | — | — | |
| SCHEMBL14841962 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 200287 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6423992-B1 | — | — | None | — | — | US | claimed |
| US-20260150649-A1 | GATE ALL AROUND BACKSIDE POWER RAIL FORMATION WITH MULTI-COLOR BACKSIDE DIELECTRIC ISOLATION SCHEME | APPLIED MATERIALS, INC. (US) | 2026-05-28 | — | — | US | claimed |
| US-20260150298-A1 | SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2026-05-28 | — | — | US | claimed |
| US-20260150580-A1 | PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE, AND PROCESS FOR MANUFACTURING A PIEZOELECTRIC-ON-INSULATOR (POI) SUBSTRATE | SOITEC (FR) | 2026-05-28 | — | — | US | claimed |
| US-20260150377-A1 | SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2026-05-28 | — | — | US | claimed |
| US-20260150629-A1 | SEMICONDUCTOR STRUCTURES WITH INTEGRATED LASER DEBONDING TEST STRUCTURES | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2026-05-28 | — | — | US | claimed |
| EP-3971992-B1 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECH INC (CN) | 2026-05-27 | — | — | EP | claimed |
| EP-4747333-A1 | COMPOSITIONS COMPRISING 1,1,1,4,4,4-HEXAFLUORO-2-BUTYNE | The Chemours Company FC, LLC (US) | 2026-05-27 | — | — | EP | claimed |
| US-12641802-B2 | Liner to form composite high-K dielectric | APPLIED MATERIALS, INC. (US) | 2026-05-26 | — | — | US | claimed |
| CN-116742462-B | Saturable absorber based on tantalum nitride quantum dots, preparation method and mode-locked fiber laser | GUANGDONG UNIVERSITY OF TECHNOLOGY (CN) | 2026-05-26 | — | — | CN | claimed |
| US-4057777-A | Termination for electrical resistor and method of making same | TRW INC. (US) | 1977-11-08 | — | — | US | claimed |
| US-4053866-A | MOLYBDENUM ANDOR TUNGSTEN | TRW INC. (US) | 1977-10-11 | — | — | US | claimed |
| US-4052738-A | STYLUS FOR CAPACITIVE VIDEODISC | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JA) | 1977-10-04 | — | — | US | claimed |
| US-4043839-A | DIFFUSION | ALLEGHENY LUDLUM INDUSTRIES, INC. (US) | 1977-08-23 | — | — | US | claimed |
| US-3988824-A | Method for manufacturing thin film circuits | HEWLETT-PACKARD COMPANY (US) | 1976-11-02 | — | — | US | claimed |
| US-3973106-A | Thin film thermal print head | HEWLETT-PACKARD COMPANY (US) | 1976-08-03 | — | — | US | claimed |
| US-3970816-A | Electric heater for heating lubricating oils | HOSOKAWA HISASHI | 1976-07-20 | — | — | US | claimed |
| US-3969553-A | NITRIDE | TOYOTA JIDOSHA KOGYO KABUSHIKI KAISHA (JA) | 1976-07-13 | — | — | US | claimed |
| US-3941903-A | Wear-resistant bearing material and a process for making it | UNION CARBIDE CORPORATION (US) | 1976-03-02 | — | — | US | claimed |
| US-3930975-A | SPUTTERING METHOD FOR PRODUCING SOLDER-FAST COPPER LAYERS | ROBERT BOSCH G.M.B.H. (DT) | 1976-01-06 | — | — | US | claimed |