SCHEMBL20109894

SCHEMBL20109894

O=S(=O)(NS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)S(=O)(=O)NCCNCCC(F)(F)F)C(F)(F)F

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.33
CA1 P00915 5/20 0.31
CA2 P00918 5/20 0.31
MMP1 P03956 2/20 0.30
MMP2 P08253 2/20 0.30
MMP9 P14780 2/20 0.30
MMP8 P22894 2/20 0.30
MMP13 P45452 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19820342 0.86 EPHX1 (0.34) EPHX1CA1CA2MMP1MMP2
SCHEMBL16328562 0.84 EPHX1 (0.37) EPHX1CA1CA2MMP1MMP2
SCHEMBL21164000 0.84 EPHX1 (0.44) EPHX1CA1CA2MMP1MMP2
SCHEMBL21421506 0.84 EPHX1 (0.35) EPHX1CA1CA2
SCHEMBL22876809 0.79 EPHX1 (0.40) EPHX1CA1CA2MMP1MMP2
SCHEMBL14949357 0.77 EPHX1 (0.37) EPHX1CA1CA2MMP1MMP2
SCHEMBL26451839 0.74 EPHX1 (0.59) EPHX1CA1CA2MMP1MMP2
SCHEMBL15935702 0.74 EPHX1 (0.59) EPHX1CA1CA2MMP1MMP2
SCHEMBL13103134 0.73 EPHX1 (0.38) EPHX1CA1CA2MMP1MMP2
SCHEMBL21653874 0.72 ALDH1A1 (0.37) CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10928727-B2 Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank including actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing FUJIFILM CORPORATION (JP) 2021-02-23 US disclosed
US-10663864-B2 Pattern forming method, method for manufacturing electronic device, and laminate FUJIFILM CORPORATION (JP) 2020-05-26 US disclosed
US-20180181003-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LAMINATE FUJIFILM CORPORATION (JP) 2018-06-28 US disclosed
US-20180120701-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MASK BLANK INCLUDING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed