⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Fluoride SCHEMBL7103699 | 0.82 | — | — | |
| Fluoride SCHEMBL8895154 | 0.82 | — | — | |
| Fluoride SCHEMBL81457 | 0.82 | — | — | |
| Fluoride SCHEMBL1004340 | 0.82 | — | — | |
| Fluoride SCHEMBL37567 | 0.82 | — | — | |
| Fluoride SCHEMBL2514392 | 0.82 | — | — | |
| Fluoride SCHEMBL11685317 | 0.82 | — | — | |
| Fluoride SCHEMBL6328976 | 0.82 | — | — | |
| Fluoride SCHEMBL8895159 | 0.82 | — | — | |
| Fluoride SCHEMBL10481826 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240051019-A1 | JOINED PARTS COMPRISING A JOINT MATERIAL | GENERAL ELECTRIC COMPANY (US) | 2024-02-15 | — | — | US | claimed |
| US-20230082562-A1 | BINDERS COMPRISING A MONOMER AND AN INITIATOR FOR USE IN ADDITIVE MANUFACTURING | GENERAL ELECTRIC COMPANY (US) | 2023-03-16 | — | — | US | claimed |
| US-9005485-B2 | High performance die attach adhesives (DAAs) nanomaterials for high brightness LED | NANO AND ADVANCED MATERIALS INSTITUTE LIMITED (HK) | 2015-04-14 | — | — | US | claimed |
| US-8309633-B2 | Low temperature, cationically curable compositions with improved cure speed and toughness | HENKEL IRELAND LTD. (IE) | 2012-11-13 | — | — | US | claimed |
| US-20100016494-A1 | LOW TEMPERATURE, CATIONICALLY CURABLE COMPOSITIONS WITH IMPROVED CURE SPEED AND TOUGHNESS | HENKEL IRELAND LIMITED (IE) | 2010-01-21 | — | — | US | claimed |
| US-7554793-B2 | Low temperature curable conductive adhesive and capacitors formed thereby | KEMET ELECTRONICS CORPORATION (US) | 2009-06-30 | — | — | US | claimed |
| WO-2008067198-A2 | LOW TEMPERATURE CURABLE CONDUCTIVE ADHESIVE AND CAPACITORS FORMED THEREBY | KEMET ELECTRONICS CORPORATION (US) | 2008-06-05 | — | — | WO | claimed |
| US-20080116416-A1 | Low temperature curable conductive adhesive and capacitors formed thereby | KEMET BLUE POWDER CORPORATION | 2008-05-22 | — | — | US | claimed |
| EP-3632950-B1 | STORAGE-STABLE HEAT-CURABLE HYBRID EPOXY FUNCTIONAL COMPOSITION AND TRANSPARENT HEAT-CURED COATINGS PREPARED THEREFROM | ESSILOR INT (FR) | 2024-07-17 | — | — | EP | disclosed |
| US-11919233-B2 | Method of edge printing for use in additive manufacturing processes | GENERAL ELECTRIC COMPANY (US) | 2024-03-05 | — | — | US | disclosed |
| US-20240051019-A1 | JOINED PARTS COMPRISING A JOINT MATERIAL | GENERAL ELECTRIC COMPANY (US) | 2024-02-15 | — | — | US | disclosed |
| EP-4321278-A1 | JOINED PARTS COMPRISING A JOINT MATERIAL | General Electric Company (US) | 2024-02-14 | — | — | EP | disclosed |
| US-11709290-B2 | Heat curable epoxy compositions and transparent heat-cured coatings with durable adhesion prepared therefrom | ESSILOR INTERNATIONAL (FR) | 2023-07-25 | — | — | US | disclosed |
| US-11685841-B2 | Adhesives and related methods | AVERY DENNISON CORPORATION (US) | 2023-06-27 | — | — | US | disclosed |
| US-20100214732-A1 | ARTICLE WITH GASKET HAVING MOISTURE TRANSMISSION RESISTIVITY AND METHOD | 3M INNOVATIVE PROPERTIES COMPANY | 2010-08-26 | — | — | US | disclosed |
| US-20100016494-A1 | LOW TEMPERATURE, CATIONICALLY CURABLE COMPOSITIONS WITH IMPROVED CURE SPEED AND TOUGHNESS | HENKEL IRELAND LIMITED (IE) | 2010-01-21 | — | — | US | disclosed |
| CN-101622324-A | Low temperature curable conductive adhesive and capacitor formed therefrom | KEMET ELECTRONICS CORP | 2010-01-06 | — | — | CN | disclosed |
| US-7554793-B2 | Low temperature curable conductive adhesive and capacitors formed thereby | KEMET ELECTRONICS CORPORATION (US) | 2009-06-30 | — | — | US | disclosed |
| WO-2008067198-A2 | LOW TEMPERATURE CURABLE CONDUCTIVE ADHESIVE AND CAPACITORS FORMED THEREBY | KEMET ELECTRONICS CORPORATION (US) | 2008-06-05 | — | — | WO | disclosed |
| US-20080116416-A1 | Low temperature curable conductive adhesive and capacitors formed thereby | KEMET BLUE POWDER CORPORATION | 2008-05-22 | — | — | US | disclosed |