SCHEMBL20164932

SCHEMBL20164932

O=C(O)c1ccc2c(c1)nnn2CCC1CCCC1

nearest known ligand 0.64

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
HCAR3 P49019 17/20 0.64
HSD17B10 Q99714 1/20 0.50
GAA P10253 1/20 0.50
HPGD P15428 1/20 0.47
HCAR2 Q8TDS4 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6043985 0.82 HCAR3 (0.66) HCAR3HPGDHCAR2
SCHEMBL6044508 0.79 HCAR3 (1.00) HCAR3HPGDHCAR2
SCHEMBL6033322 0.79 HCAR3 (0.74) HCAR3HPGDHCAR2
SCHEMBL6688047 0.78 HCAR3 (0.77) HCAR3HSD17B10
SCHEMBL6044222 0.78 HCAR3 (0.73) HCAR3HPGDHCAR2
SCHEMBL6044288 0.78 HCAR3 (0.78) HCAR3HPGDHCAR2
SCHEMBL6044071 0.76 HCAR3 (1.00) HCAR3HPGDHCAR2
SCHEMBL15555892 0.76 HCAR3 (0.76) HCAR3HPGDHCAR2
SCHEMBL6044058 0.76 HCAR3 (1.00) HCAR3HPGDHCAR2
SCHEMBL21728478 0.76 HCAR3 (0.73) HCAR3HPGDHCAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12493244-B2 Photosensitive resin composition, photosensitive dry film, and pattern formation method SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-09 US disclosed
CN-114600045-B Photosensitive resin composition, photosensitive dry film and pattern forming method 信越化学工业株式会社 2025-05-09 CN disclosed
EP-4050054-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD SHINETSU CHEMICAL CO (JP) 2025-04-23 EP disclosed
CN-111338181-B Photosensitive resin composition, photosensitive dry film and pattern forming method 信越化学工业株式会社 2024-11-26 CN disclosed
US-20230176479-A1 NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-08 US disclosed
EP-4167028-A1 NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-19 EP disclosed
CN-115885217-A Negative resist film laminate and pattern forming method 信越化学工业株式会社 2023-03-31 CN disclosed
CN-108107676-B Chemically amplified positive resist film laminate and pattern formation method 信越化学工业株式会社 2023-02-21 CN disclosed
US-11460774-B2 Photosensitive resin composition, photosensitive dry film, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-10-04 US disclosed
EP-4050054-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD Shin-Etsu Chemical Co., Ltd. (JP) 2022-08-31 EP disclosed
CN-114600045-A Photosensitive resin composition, photosensitive dry film and pattern forming method 信越化学工业株式会社 2022-06-07 CN disclosed
EP-3671345-B1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2022-02-02 EP disclosed
WO-2021079679-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD 信越化学工業株式会社 2021-04-29 WO disclosed
US-20200201182-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-25 US disclosed
EP-3671345-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2020-06-24 EP disclosed
EP-3327504-B1 CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS SHINETSU CHEMICAL CO (JP) 2019-05-15 EP disclosed
EP-3327504-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2018-05-30 EP disclosed
US-20180143535-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST FILM LAMINATE AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-24 US disclosed