⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1827792 | 0.85 | — | — | |
| SCHEMBL1829074 | 0.80 | — | — | |
| SCHEMBL915464 | 0.76 | — | — | |
| Benzene SCHEMBL28857089 | 0.76 | — | — | |
| SCHEMBL1829570 | 0.73 | — | — | |
| SCHEMBL9746825 | 0.71 | TSHR (0.39) | — | |
| SCHEMBL3626208 | 0.69 | — | — | |
| SCHEMBL1827406 | 0.67 | — | — | |
| Benzene SCHEMBL28857070 | 0.67 | — | — | |
| SCHEMBL3481847 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117730398-A | Resin composition for dicing protective layer and method for processing semiconductor wafer | 株式会社力森诺科 | 2024-03-19 | — | — | CN | disclosed |
| WO-2022129201-A1 | PLATELET-LIKE MATTING AGENT FOR POWDER COATING AND POWDER COATINGS | ECKART GMBH (DE) | 2022-06-23 | — | — | WO | disclosed |
| EP-2698403-B1 | Surface modified pearlescent pigments and their use in powder coatings | ECKART GMBH (DE) | 2018-01-03 | — | — | EP | disclosed |
| US-9680183-B2 | Lithium secondary battery and method for producing same | TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) | 2017-06-13 | — | — | US | disclosed |
| US-20150221983-A1 | LITHIUM SECONDARY BATTERY AND METHOD FOR PRODUCING SAME | TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) | 2015-08-06 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| EP-2318463-B1 | METAL EFFECT PIGMENTS, METHOD FOR THE PRODUCTION AND THE USE THEREOF AND POWDER COATING | ECKART GMBH (DE) | 2014-10-01 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| EP-2698403-A1 | Surface modified pearlescent pigments and their use in powder coatings | Eckart GmbH (DE) | 2014-02-19 | — | — | EP | disclosed |
| CN-102089390-B | Metal pigments, coating powder, method for the production and the use thereof | ECKART GMBH | 2013-09-04 | — | — | CN | disclosed |
| US-8304077-B2 | Metal effect pigments, method for the production and the use thereof and powder coating | ECKART GMBH (DE) | 2012-11-06 | — | — | US | disclosed |
| US-20110160389-A1 | METAL EFFECT PIGMENTS, METHOD FOR THE PRODUCTION AND THE USE THEREOF AND POWDER COATING | ECKART GMBH (DE) | 2011-06-30 | — | — | US | disclosed |
| CN-102089390-A | Metal effect pigments, method for the production and the use thereof and powder coating | ECKART GMBH | 2011-06-08 | — | — | CN | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |