SCHEMBL20183961

SCHEMBL20183961

C=CCOC(=O)C1(C(=O)OCC=C)C=CCCC1

nearest known ligand 0.34

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.34
PTP4A3 O75365 1/20 0.31
PTP4A1 Q93096 1/20 0.31
ALDH1A1 P00352 1/20 0.30
TSHR P16473 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20183969 0.95 CYP3A4 (0.33) CYP3A4
SCHEMBL20695810 0.90 CYP3A4 (0.36) CYP3A4ALDH1A1TSHRHSD17B10
SCHEMBL29352574 0.82
SCHEMBL20183945 0.81 CYP3A4 (0.39) CYP3A4PTP4A3PTP4A1ALDH1A1TSHR
SCHEMBL20995886 0.78 SMN1; SMN2 (0.39) ALDH1A1
SCHEMBL20995915 0.75 ALDH1A1 (0.33) CYP3A4ALDH1A1TSHRHSD17B10
SCHEMBL3788158 0.74 CYP3A4 (0.32) CYP3A4TSHR
SCHEMBL20995932 0.73 ALDH1A1 (0.39) CYP3A4ALDH1A1TSHR
SCHEMBL7934500 0.72 TP53 (0.41) CYP3A4ALDH1A1
SCHEMBL20995907 0.72 NAAA (0.39) CYP3A4ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3674329-B1 PHOTOCURABLE RESIN COMPOSITION, INK, AND PAINT OSAKA SODA CO LTD (JP) 2024-07-17 EP disclosed
WO-2023281971-A1 ACTIVE-ENERGY-RAY-CURABLE RESIN COMPOSITION, ACTIVE-ENERGY-RAY-CURABLE PIGMENT DISPERSION, INK COMPOSITION FOR OFFSET INK, AND INK COMPOSITION FOR FLEXOGRAPHIC INK 東洋インキSCホールディングス株式会社 2023-01-12 WO disclosed
CN-109071936-B Composition for laminate 株式会社大阪曹达 2022-01-25 CN disclosed
US-20210070909-A1 THERMOSETTING RESIN COMPOSITION OSAKA SODA CO., LTD. (JP) 2021-03-11 US disclosed
EP-3778680-A1 THERMOSETTING RESIN COMPOSITION Osaka Soda Co., Ltd. (JP) 2021-02-17 EP disclosed
CN-111868123-A Thermosetting resin composition 株式会社大阪曹达 2020-10-30 CN disclosed
EP-3438135-B1 PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME OSAKA SODA CO LTD (JP) 2020-09-23 EP disclosed
EP-3674329-A1 PHOTOCURABLE RESIN COMPOSITION, INK, AND PAINT Osaka Soda Co., Ltd. (JP) 2020-07-01 EP disclosed
US-10604600-B2 Photocurable resin composition and cured product of same OSAKA SODA CO., LTD. (JP) 2020-03-31 US disclosed
US-20200040157-A1 NANOSUBSTANCE-CONTAINING COMPOSITION OSAKA SODA CO LTD (JP) 2020-02-06 US disclosed
US-20190136042-A1 COMPOSITION FOR LAMINATES OSAKA SODA CO.,LTD. (JP) 2019-05-09 US disclosed
US-20190100608-A1 PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME OSAKA SODA CO., LTD. (JP) 2019-04-04 US disclosed
EP-3438135-A1 PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME Osaka Soda Co., Ltd. (JP) 2019-02-06 EP disclosed
US-20180186064-A1 COMPOSITION FOR LINING OSAKA SODA CO., LTD. (JP) 2018-07-05 US disclosed
EP-3326784-A1 COMPOSITION FOR LINING Osaka Soda Co., Ltd. (JP) 2018-05-30 EP disclosed