SCHEMBL2023964

SCHEMBL2023964

[Pt]CC=CC1=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3414547 0.80
SCHEMBL3414541 0.80
SCHEMBL18987229 0.78
SCHEMBL249129 0.78
SCHEMBL2896531 0.78
SCHEMBL9176874 0.78
SCHEMBL17474255 0.77
Ethylene SCHEMBL27762520 0.77
SCHEMBL5858227 0.75
SCHEMBL6562280 0.74 L3MBTL1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7968463-B2 Formation method of metallic compound layer, manufacturing method of semiconductor device, and formation apparatus for metallic compound layer RENESAS ELECTRONICS CORPORATION (JP) 2011-06-28 US disclosed
US-20100084713-A1 Semiconductor device manufacturing method and semiconductor device NEC CORPORATION (JP) 2010-04-08 US disclosed
US-20090170252-A1 Formation method of metallic compound layer, manufacturing method of semiconductor device, and formation apparatus for metallic compound layer RENESAS ELECTRONICS CORPORATION (JP) 2009-07-02 US disclosed