SCHEMBL2896531

SCHEMBL2896531

[Ni]CC=CC1=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9176874 0.83
SCHEMBL3414541 0.80
SCHEMBL3414547 0.80
SCHEMBL18987229 0.78
SCHEMBL249129 0.78
SCHEMBL2023964 0.78
Ethylene SCHEMBL27762520 0.77
SCHEMBL17474255 0.77
SCHEMBL5858227 0.75
SCHEMBL6562275 0.74 L3MBTL1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130157450-A1 Methods of Forming Metal Silicide Regions on Semiconductor Devices GLOBALFOUNDRIES INC. (KY) 2013-06-20 US claimed
US-7045457-B2 Film forming material, film forming method, and silicide film TRI CHEMICAL LABORATORES INC. (JP) 2006-05-16 US claimed
US-20050059243-A1 Film forming material, film forming method, and silicide film TRI CHEMICAL LABORATORIES INC. (JP) 2005-03-17 US claimed
US-20260088258-A1 EDGE EXCLUSION CONTROL LAM RES CORP (US) 2026-03-26 US disclosed
US-12544749-B2 Method for preparing single-atom, atomic cluster or single-molecular catalyst for oxidative coupling of methane using chemical vapor deposition KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2026-02-10 US disclosed
US-12531210-B2 Edge exclusion control LAM RESEARCH CORPORATION (US) 2026-01-20 US disclosed
US-12509768-B2 Method of manufacturing semiconductor device, substrate processing apparatus and evaporation system Kokusai Electric Corporation (JP) 2025-12-30 US disclosed
US-20250314008-A1 Ceramic-Polymer Composites and Methods of Making the Same TEMPLE UNIVERSITY OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION 2025-10-09 US disclosed
US-20250029840-A1 MOLYBDENUM DEPOSITION LAM RES CORP (US) 2025-01-23 US disclosed
US-12148623-B2 Deposition of tungsten on molybdenum templates LAM RESEARCH CORPORATION (US) 2024-11-19 US disclosed
US-20240351880-A1 METHOD FOR PREPARING SINGLE-WALLED CARBON NANOTUBES USING SINGEL-ATOM CATALYST, AND SINGLE-WALLED CARBON NANOTUBES PREPARED THEREBY KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2024-10-24 US disclosed
US-20130302980-A1 TUNGSTEN FEATURE FILL NOVELLUS SYSTEMS, INC. 2013-11-14 US disclosed
US-20130267100-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND EVAPORATION SYSTEM HITACHI KOKUSAI ELECTRIC INC. (JP) 2013-10-10 US disclosed
US-20130157450-A1 Methods of Forming Metal Silicide Regions on Semiconductor Devices GLOBALFOUNDRIES INC. (KY) 2013-06-20 US disclosed
US-20100286423-A1 NICKEL-CONTAINING FILM-FORMING MATERIAL AND PROCESS FOR PRODUCING NICKEL-CONTAINING FILM SHOWA DENKO K.K. (JP) 2010-11-11 US disclosed
EP-2111488-A2 ATOMIC LAYER DEPOSITION ON FIBROUS MATERIALS Honeywell International Inc. (US) 2009-10-28 EP disclosed
WO-2008140578-A2 ATOMIC LAYER DEPOSITION ON FIBROUS MATERIALS HONEYWELL INTERNATIONAL INC. (US) 2008-11-20 WO disclosed
US-20080119098-A1 Atomic layer deposition on fibrous materials HONEYWELL INTERNATINAL INC. 2008-05-22 US disclosed
US-7045457-B2 Film forming material, film forming method, and silicide film TRI CHEMICAL LABORATORES INC. (JP) 2006-05-16 US disclosed
US-20050059243-A1 Film forming material, film forming method, and silicide film TRI CHEMICAL LABORATORIES INC. (JP) 2005-03-17 US disclosed