Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.38 |
| ▸ | NPC1 | O15118 | 3/20 | 0.38 |
| ▸ | RAB9A | P51151 | 3/20 | 0.38 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.38 |
| ▸ | PLA2G1B | P04054 | 1/20 | 0.38 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.38 |
| ▸ | CASP3 | P42574 | 1/20 | 0.38 |
| ▸ | NFKB2 | Q00653 | 1/20 | 0.38 |
| ▸ | RELA | Q04206 | 1/20 | 0.38 |
| ▸ | SENP8 | Q96LD8 | 1/20 | 0.38 |
| ▸ | SENP7 | Q9BQF6 | 1/20 | 0.38 |
| ▸ | SENP6 | Q9GZR1 | 1/20 | 0.38 |
| ▸ | ATG4B | Q9Y4P1 | 1/20 | 0.38 |
| ▸ | RXRB | P28702 | 3/20 | 0.36 |
| ▸ | RXRA | P19793 | 2/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL374594 | 0.90 | ALDH1A1 (0.40) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| Phosphoric Acid SCHEMBL8431598 | 0.87 | ALDH1A1 (0.38) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| Phosphonic Acid SCHEMBL2197000 | 0.87 | ALDH1A1 (0.51) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| SCHEMBL7651048 | 0.87 | ALDH1A1 (0.37) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| SCHEMBL10728564 | 0.87 | ALDH1A1 (0.37) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| Phosphonic Acid SCHEMBL29555516 | 0.81 | RXRA (0.44) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| SCHEMBL29763177 | 0.78 | ALDH1A1 (0.48) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| SCHEMBL2357462 | 0.78 | ALDH1A1 (0.48) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| SCHEMBL30390677 | 0.78 | EGFR (0.34) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B | |
| Phosphonic Acid SCHEMBL455332 | 0.77 | ALDH1A1 (0.49) | ALDH1A1NPC1RAB9AL3MBTL1PLA2G1B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4678700-A1 | ELECTROMAGNETIC-WAVE-SHIELDING COMPOSITION INCLUDING THERMOPLASTIC RESIN OR THERMOPLASTIC ELASTOMER AND MOLDED ARTICLE COMPRISING SAME | TOYOBO MC Corporation (JP) | 2026-01-14 | — | — | EP | disclosed |
| EP-4617324-A1 | COMPOSITION COMPRISING THERMOPLASTIC RESIN OR THERMOPLASTIC ELASTOMER | TOYOBO MC Corporation (JP) | 2025-09-17 | — | — | EP | disclosed |
| WO-2024185635-A1 | ELECTROMAGNETIC-WAVE-SHIELDING COMPOSITION INCLUDING THERMOPLASTIC RESIN OR THERMOPLASTIC ELASTOMER AND MOLDED ARTICLE COMPRISING SAME | 東洋紡エムシー株式会社 | 2024-09-12 | — | — | WO | disclosed |
| WO-2024101251-A1 | COMPOSITION COMPRISING THERMPLASTIC RESIN OR THERMOPLASTIC ELASTOMER | 東洋紡エムシー株式会社 | 2024-05-16 | — | — | WO | disclosed |
| EP-2768031-B1 | LIGHT-EMITTING DEVICE | NICHIA CORP (JP) | 2021-02-17 | — | — | EP | disclosed |
| EP-3190144-B1 | EPOXY-MODIFIED SILICONE RESIN, MAKING METHOD, CURABLE COMPOSITION, AND ELECTRONIC PART | SHINETSU CHEMICAL CO (JP) | 2018-08-08 | — | — | EP | disclosed |
| US-9896550-B2 | Epoxy-modified silicone resin, making method, curable composition, and electronic part | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-02-20 | — | — | US | disclosed |
| US-9884960-B2 | White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-02-06 | — | — | US | disclosed |
| US-9808970-B2 | Light-emitting device, method for manufacturing same, and molded part | NICHIA CORPORATION (JP) | 2017-11-07 | — | — | US | disclosed |
| US-20170198102-A1 | EPOXY-MODIFIED SILICONE RESIN, MAKING METHOD, CURABLE COMPOSITION, AND ELECTRONIC PART | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-07-13 | — | — | US | disclosed |
| EP-2323178-A2 | Light-emitting device, method for manufacturing same, molded body and sealing member | Nichia Corporation (JP) | 2011-05-18 | — | — | EP | disclosed |
| US-20100155739-A1 | LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, MOLDED BODY AND SEALING MEMBER | NICHIA CORPORATION (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100125116-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-05-20 | — | — | US | disclosed |
| EP-2186844-A1 | Heat-curable resin composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-05-19 | — | — | EP | disclosed |
| US-20100104794-A1 | THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-04-29 | — | — | US | disclosed |
| US-20100001311-A1 | HEAT-CURABLE SILICONE RESIN-EPOXY RESIN COMPOSITION, AND PREMOLDED PACKAGE MOLDED FROM SAME | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-01-07 | — | — | US | disclosed |
| EP-2141201-A1 | Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| US-20080255283-A1 | Di- or polyester prepared from triglycidyl isocyanurate and an anhydride such as methylhexahydrophthalic anhydride, glyceride internal parting agent, reflective agent, inorganic filler, and a curing catalyst; encapsulated semiconductors | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2008-10-16 | — | — | US | disclosed |
| US-20080187762-A1 | Curing a thermosetting epoxy resin with acid anhydride; mixture with reflective agent, filler and curing agent | NICHIA CORPORATION (JP) | 2008-08-07 | — | — | US | disclosed |
| EP-1914811-A1 | LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, MOLDED BODY AND SEALING MEMBER | Nichia Corporation (JP) | 2008-04-23 | — | — | EP | disclosed |