⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11309928 | 0.98 | — | — | |
| SCHEMBL728319 | 0.98 | — | — | |
| SCHEMBL200496 | 0.93 | — | — | |
| SCHEMBL702188 | 0.88 | LMNA (0.31) | — | |
| SCHEMBL3145493 | 0.87 | — | — | |
| SCHEMBL3158581 | 0.87 | — | — | |
| SCHEMBL10579700 | 0.87 | LMNA (0.32) | — | |
| SCHEMBL8512727 | 0.85 | LMNA (0.34) | — | |
| SCHEMBL13268839 | 0.85 | LMNA (0.34) | — | |
| SCHEMBL29512548 | 0.85 | LMNA (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119744666-B | Seedling raising method for Ficus simplicissima lour and application of seedling raising method | 广东良田农林科技有限公司 | 2025-05-23 | — | — | CN | claimed |
| CN-119744666-A | Seedling raising method for Ficus simplicissima lour and application of seedling raising method | 广东良田农林科技有限公司 | 2025-04-04 | — | — | CN | claimed |
| CN-108250326-B | A kind of polymer containing hydroxy-functional side group and preparation method thereof and branching/network polymer | 北京化工大学 | 2019-11-15 | — | — | CN | claimed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| EP-3932692-B1 | SULFUR-CONTAINING SILANE COMPOUND AND COMPOSITION THEREOF | ENEOS MAT CORPORATION (JP) | 2026-04-01 | — | — | EP | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| EP-3255113-B1 | ADHESIVE AND/OR SEALANT COMPOSITION WITH HIGH INITIAL TACK | SOUDAL (BE) | 2025-11-05 | — | — | EP | disclosed |
| US-20120074575-A1 | COPPER LINE HAVING SELF-ASSEMBLED MONOLAYER FOR ULSI SEMICONDUCTOR DEVICES, AND A METHOD OF FORMING SAME | IUCF-HYU (Industry-Univeristy Cooperation Foundation Hanyang University) (KR) | 2012-03-29 | — | — | US | disclosed |
| US-20120041136-A1 | CONJUGATED DIENE-BASED POLYMER, CONJUGATED DIENE-BASED POLYMER COMPOSITION, AND PROCESS FOR PRODUCING CONJUGATED DIENE-BASED POLYMER | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2012-02-16 | — | — | US | disclosed |
| US-8088687-B2 | Method for forming copper line having self-assembled monolayer for ULSI semiconductor devices | HYNIX SEMICONDUCTOR INC. (KR) | 2012-01-03 | — | — | US | disclosed |
| CN-101993537-A | Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same | ASAHI KASEI E MATERIALS CORP | 2011-03-30 | — | — | CN | disclosed |
| CN-101853782-A | Copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same | HYNIX SEMICONDUCTOR INC | 2010-10-06 | — | — | CN | disclosed |
| US-20100244253-A1 | COPPER LINE HAVING SELF-ASSEMBLED MONOLAYER FOR ULSI SEMICONDUCTOR DEVICES, AND A METHOD OF FORMING SAME | HYNIX SEMICONDUCTOR INC. (KR) | 2010-09-30 | — | — | US | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |