SCHEMBL200496

SCHEMBL200496

CCCO[Si](CCCS)(OCCC)OCCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3158581 0.94
SCHEMBL3145493 0.94
SCHEMBL202701 0.93
SCHEMBL11309928 0.91
SCHEMBL728319 0.91
SCHEMBL3144976 0.89 LMNA (0.36)
SCHEMBL375678 0.89 LMNA (0.36)
SCHEMBL477865 0.88 ADRB2 (0.33)
SCHEMBL5152987 0.86
SCHEMBL14191178 0.86 LPAR2 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 730 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025057176-A1 DUAL FUNCTIONALIZED FLUORINATED POLYMER BASED STABLE CATION EXCHANGE MEMBRANE AND ITS PREPARATION METHOD THEREOF KADVEKAR CHANDRASHEKHAR VINAYAK (IN) 2025-03-20 WO claimed
WO-2024216910-A1 HIGH-CHEMICAL-RESISTANCE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND USE THEREOF 明士(北京)新材料开发有限公司 2024-10-24 WO claimed
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-116836389-B Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2024-01-26 CN claimed
CN-116836388-B Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-15 CN claimed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN claimed
CN-114230792-B Positive photosensitive polyimide resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116836389-A Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116836388-A Positive photosensitive resin, resin composition, preparation method and application thereof 明士(北京)新材料开发有限公司 2023-10-03 CN claimed
CN-116149140-B Positive photosensitive resin composition with high chemical resistance and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-07-14 CN claimed
WO-2019100102-A1 AN EEG MONITORING APPARATUS AND METHOD OF ITS PLACEMENT Seer Medical Pty Ltd (AU) 2019-05-31 WO claimed
EP-3444296-A1 DIRECTLY COATED POLYOLEFIN FILM AND PREPARATION METHOD THEREFOR GUANGDONG ZHONGKE HUATONG NEW MATERIALS TECHNOLOGY CO., LTD. (CN) 2019-02-20 EP claimed
CN-104162665-B Gold-organic silicon-gold multilayer core-shell nano-structure and preparing method and application thereof 华东理工大学 2017-01-11 CN claimed
EP-1341843-B2 MINERAL-FILLED ELASTOMER COMPOSITIONS MOMENTIVE PERFORMANCE MAT INC (US) 2016-03-23 EP claimed
US-7518009-B2 Process for preparing mercaptoorganyl (alkoxysilanes) EVONIK DEGUSSA GMBH (DE) 2009-04-14 US claimed
EP-1341843-B1 MINERAL-FILLED ELASTOMER COMPOSITIONS GEN ELECTRIC (US) 2007-01-17 EP claimed
US-20060252952-A1 Process for preparing mercaptoorganyl (alkoxysilanes) DEGUSSA AG (DE) 2006-11-09 US claimed
US-6635700-B2 Mixture of a latent mercaptosilane coupling agent and an additional mercaptan activator used to cure sulfur vulcanizable rubber CROMPTON CORPORATION 2003-10-21 US claimed
US-20020115767-A1 Mineral-filled elastomer compositions MOMENTIVE PERFORMANCE MATERIALS INC. 2002-08-22 US claimed
US-6414077-B1 BEDDING COMPOUNDS SCHNEE-MOREHEAD, INC. 2002-07-02 US claimed