SCHEMBL202864

SCHEMBL202864

Nc1ccc(Oc2ccc(Oc3ccc(Oc4ccc(N)cc4)cc3)cc2)cc1

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 1.00
TDP1 Q9NUW8 4/20 1.00
CYP3A4 P08684 2/20 1.00
TSHR P16473 1/20 1.00
MAOA P21397 2/20 0.78
MAPT P10636 6/20 0.74
TEAD4 Q15561 1/20 0.74
MAOB P27338 1/20 0.74
MEN1 O00255 4/20 0.70
KMT2A Q03164 4/20 0.70
SMN1; SMN2 Q16637 3/20 0.70
POLB P06746 1/20 0.70
MITF O75030 1/20 0.70
GAA P10253 1/20 0.70
GFER P55789 1/20 0.70
NLRP1 Q9C000 1/20 0.70
NOD2 Q9HC29 1/20 0.70
NPC1 O15118 3/20 0.64
RAB9A P51151 3/20 0.64
MAPK1 P28482 3/20 0.64

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1331804 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL2013073 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL41849 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL4455485 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL10576066 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL65211 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL4446167 1.00 ALDH1A1 (1.00) ALDH1A1TDP1CYP3A4TSHRMAOA
Hydrochloric Acid SCHEMBL8641976 0.97 ALDH1A1 (0.93) ALDH1A1TDP1CYP3A4TSHRMAOA
Ammonia Solution, Strong SCHEMBL4071133 0.97 ALDH1A1 (0.93) ALDH1A1TDP1CYP3A4TSHRMAOA
Ammonia Solution, Strong SCHEMBL2009106 0.97 ALDH1A1 (0.93) ALDH1A1TDP1CYP3A4TSHRMAOA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3187 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260132256-A1 POLYAMIC ACID COMPOSITION AND POLYIMIDE PREPARED WITH THE SAME PI ADVANCED MAT CO LTD (KR) 2026-05-14 US claimed
US-20260132262-A1 BLACK POLYIMIDE FILM AND THE MANUFACTURING METHOD THEREOF PI ADVANCED MAT CO LTD (KR) 2026-05-14 US claimed
US-20260125577-A1 SELF-LUBRICATING POLYIMIDE VARNISH AND POLYIMIDE COATING PREPARED THEREFROM PI ADVANCED MAT CO LTD (KR) 2026-05-07 US claimed
US-20260092194-A1 POLYIMIDE VARNISH WITH IMPROVED PULSE ENDURANCE AND POLYIMIDE COATING MATERIAL PREPARED THEREOF PI ADVANCED MAT CO LTD (KR) 2026-04-02 US claimed
EP-4714998-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME PI Advanced Materials Co., Ltd. (KR) 2026-03-25 EP claimed
US-20260062517-A1 POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESION AND POLYIMIDE CURED PRODUCT COMPRISING THE SAME PI ADVANCED MAT CO LTD (KR) 2026-03-05 US claimed
US-12522704-B2 Polyimide film having high dimensional stability and manufacturing method therefor PI ADVANCED MATERIALS CO., LTD. (KR) 2026-01-13 US claimed
US-20260008935-A1 POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR PL ADVANCED MAT CO LTD (KR) 2026-01-08 US claimed
US-12503596-B2 Low-dielectric-constant polyimide composite powder, and method for producing same PI ADVANCED MATERIALS CO., LTD. 2025-12-23 US claimed
EP-4663711-A1 METHOD OF OBTAINING INSULATING COATING COMPOSITION, COATING COMPOSITION AND CONDUCTIVE MATERIALS COMPRISING THE SAME Weg Tintas LTDA (BR) 2025-12-17 EP claimed
EP-0716113-B1 Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof TOHO RAYON KK (JP) 2000-01-19 EP claimed
EP-0418889-B1 Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof TOHO RAYON KK (JP) 1997-02-05 EP claimed
EP-0716113-A2 Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof Toho Rayon Co., Ltd. (JP) 1996-06-12 EP claimed
US-5478914-A Polyimides and processes for preparaing the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-12-26 US claimed
US-5459233-A High temperature engineering aromatic polyimides MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1995-10-17 US claimed
US-5443859-A Reacting tetracarboxylic acid dianhydride, aromatic diamine, optionally polyamine, to form polyamic acid, forming film, imidizing to form polyimide, carbonizing in inert gas or vacuum to form carbon film with specifed properties TOHO RAYON CO., LTD. (JP) 1995-08-22 US claimed
US-5399655-A Acid-labile poly(amic acetal ester) E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-03-21 US claimed
US-5288843-A Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility MITSUI TOATSU CHEMICALS, INC. (JP) 1994-02-22 US claimed
US-4381886-A HYDRAZIDE-IMIDE COPOLYMER HITACHI, LTD. (JP) 1983-05-03 US claimed
US-4064107-A High temperature polyurea resins CELANESE CORPORATION (US) 1977-12-20 US claimed