SCHEMBL202872

SCHEMBL202872

CC(C)=NO.CC(C)=NO.C[SiH3]

nearest known ligand 0.38

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
THRB P10828 1/20 0.35
BLM P54132 1/20 0.35
PMP22 Q01453 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
CYP1A2 P05177 1/20 0.35
CYP2D6 P10635 1/20 0.35
CYP2C9 P11712 1/20 0.35
TSHR P16473 1/20 0.35
CYP2C19 P33261 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22028071 1.00 ALDH1A1 (0.38) ALDH1A1THRBBLMPMP22NPSR1
SCHEMBL28296161 1.00
SCHEMBL8054304 0.89
SCHEMBL2206 0.89
SCHEMBL8525707 0.84
Water SCHEMBL5438890 0.84
SCHEMBL9078915 0.84
Hydrochloric Acid SCHEMBL6541913 0.84
SCHEMBL30146908 0.84
SCHEMBL28235050 0.84 ALDH1A1 (0.40) ALDH1A1THRBBLMPMP22NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112424269-B Resin composition for foam, and method for producing foam 株式会社钟化 2023-02-28 CN disclosed
WO-2022075386-A1 CURABLE COMPOSITION 株式会社カネカ 2022-04-14 WO disclosed
CN-114127156-A Moisture curable adhesive composition 钟化美洲控股公司 2022-03-01 CN disclosed
WO-2021261383-A1 THERMALLY CURABLE COMPOSITION AND CURED PRODUCT OF SAME 株式会社カネカ 2021-12-30 WO disclosed
CN-113801461-A Compositions with improved storage stability 株式会社钟化 2021-12-17 CN disclosed
WO-2021162048-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF 株式会社カネカ 2021-08-19 WO disclosed
WO-2021162049-A1 HEAT-CURABLE COMPOSITION, AND CURED PRODUCT THEREOF 株式会社カネカ 2021-08-19 WO disclosed
CN-112424269-A Resin composition for foam, and method for producing foam 株式会社钟化 2021-02-26 CN disclosed
WO-2020196228-A1 CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2020-10-01 WO disclosed
EP-2268255-B1 PREPARATION OF SILICONE MICROEMULSIONS DOW SILICONES CORP (US) 2020-08-26 EP disclosed
EP-1818368-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-08-15 EP disclosed
WO-2006107762-A1 ORGANOSILOXANE COMPOSITIONS DOW CORNING CORPORATION (US) 2006-10-12 WO disclosed
EP-1566412-A1 CURABLE COMPOSITION AND METHOD FOR IMPROVING RECOVERY PROPERTIES AND CREEP PROPERTIES KANEKA CORPORATION (JP) 2005-08-24 EP disclosed
EP-0265929-B1 CURABLE COMPOSITION CONTAINING ACRYLIC POLYMER AND POLYALKYLENE OXIDE KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1992-07-15 EP disclosed
EP-0029100-B2 COATING COMPOSITION COMPRISING COMPOUNDS THAT CONTAIN SILYL GROUPS AND A HYDROLYSABLE ESTER KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1992-01-15 EP disclosed
EP-0265929-A2 Curable composition containing acrylic polymer and polyalkylene oxide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-05-04 EP disclosed
EP-0054923-B1 CURABLE RESIN COMPOSITION AND ITS USE FOR PREPARING COATINGS KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1986-04-02 EP disclosed
EP-0029100-B1 COATING COMPOSITION COMPRISING COMPOUNDS THAT CONTAIN SILYL GROUPS AND A HYDROLYSABLE ESTER KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-05-16 EP disclosed
EP-0048461-A2 Vinyl resin composition containing silyl groups and a paint comprising said composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1982-03-31 EP disclosed
US-3971751-A ROOM TEMPERATURE KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JA) 1976-07-27 US disclosed