SCHEMBL20312465

SCHEMBL20312465

CC1(C)COB(c2cccnn2)OC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20312374 0.80 GOT1 (0.33) —
SCHEMBL16520900 0.77 LPL (0.39) —
SCHEMBL20312453 0.77 GOT1 (0.31) —
SCHEMBL4078174 0.70 MAPT (0.36) —
SCHEMBL20312388 0.70 GOT1 (0.34) —
SCHEMBL20312440 0.69 GOT1 (0.31) —
SCHEMBL20312464 0.69 HSP90AA1 (0.31) —
SCHEMBL20312455 0.68 SNCA (0.33) —
SCHEMBL20312409 0.67 GOT1 (0.32) —
SCHEMBL20178054 0.67 SNCA (0.40) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10504732-B2 Impurity diffusion agent composition and method for manufacturing semiconductor substrate TOKYO OHKA KOGYO CO, LTD. (JP) 2019-12-10 — — US disclosed
US-20180182624-A1 IMPURITY DIFFUSION AGENT COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2018-06-28 — — US disclosed
US-20180182624-A1 IMPURITY DIFFUSION AGENT COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2018-06-28 — — US disclosed
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