Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TAAR1 | Q96RJ0 | 9/20 | 0.37 |
| ▸ | TBXAS1 | P24557 | 2/20 | 0.37 |
| ▸ | HTR1A | P08908 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.36 |
| ▸ | TXN | P10599 | 1/20 | 0.35 |
| ▸ | TXNRD1 | Q16881 | 1/20 | 0.35 |
| ▸ | TERT | O14746 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9443992 | 1.00 | TAAR1 (0.37) | TAAR1TBXAS1HTR1ALMNACYP1A2 | |
| SCHEMBL22193265 | 0.98 | TAAR1 (0.36) | TAAR1TBXAS1HTR1ALMNACYP1A2 | |
| SCHEMBL24872814 | 0.98 | TAAR1 (0.36) | TAAR1TBXAS1HTR1ALMNACYP1A2 | |
| SCHEMBL14975558 | 0.98 | TAAR1 (0.36) | TAAR1TBXAS1HTR1ALMNACYP1A2 | |
| SCHEMBL11014678 | 0.98 | TAAR1 (0.38) | TAAR1TBXAS1HTR1ALMNACYP1A2 | |
| SCHEMBL28406709 | 0.94 | TXN (0.36) | TAAR1TBXAS1HTR1ALMNACYP1A2 | |
| SCHEMBL7855900 | 0.90 | TAAR1 (0.37) | TAAR1TBXAS1HTR1ACYP1A2CYP3A4 | |
| SCHEMBL759997 | 0.87 | TXN (0.38) | TAAR1TBXAS1HTR1ACYP1A2CYP3A4 | |
| SCHEMBL9115726 | 0.86 | TSHR (0.39) | TAAR1TBXAS1HTR1ACYP1A2CYP3A4 | |
| SCHEMBL19185693 | 0.85 | TBXAS1 (0.43) | TAAR1TBXAS1HTR1ALMNACYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20140014402-A1 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-01-16 | — | — | US | claimed |
| US-5166229-A | Polyamide wax, a castor oil wax, a sorbitol derivative and an amino acid derivative for adhesion strength, heat resistance and waterproofing | SUNSTAR GIKEN KUBUSHIKI KAISHA (JP) | 1992-11-24 | — | — | US | claimed |
| US-4906711-A | Low viscosity epoxy resin compositions | GENERAL ELECTRIC COMPANY (US) | 1990-03-06 | — | — | US | claimed |
| EP-0353103-A2 | Low viscosity epoxy resin compositions | GENERAL ELECTRIC COMPANY (US) | 1990-01-31 | — | — | EP | claimed |
| WO-2021060671-A1 | POWDER COATING COMPOSITION | 주식회사 케이씨씨 | 2021-04-01 | — | — | WO | disclosed |
| WO-2021045363-A2 | POWDER COATING COMPOSITION | 주식회사 케이씨씨 | 2021-03-11 | — | — | WO | disclosed |
| CN-105087182-B | Circuit board having solder solidified thereon, method for producing circuit board having electronic component mounted thereon, and cleaning agent composition for flux | 花王株式会社 | 2020-08-14 | — | — | CN | disclosed |
| EP-2338939-B1 | CONDUCTIVE POLYMER SOLUTION, CONDUCTIVE COATING FILM AND INPUT DEVICE | SHINETSU POLYMER CO (JP) | 2019-01-16 | — | — | EP | disclosed |
| US-8728351-B2 | Conductive polymer solution, conductive coating film and input device | SHIN-ETSU POLYMER CO., LTD. (JP) | 2014-05-20 | — | — | US | disclosed |
| CN-103540102-A | Epoxy resin composition for build-up insulating film, insulating film formed therefrom, and multilayer printed circuit board having the same | SAMSUNG ELECTRO MECH | 2014-01-29 | — | — | CN | disclosed |
| US-20140014402-A1 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME | SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) | 2014-01-16 | — | — | US | disclosed |
| US-20110175036-A1 | CONDUCTIVE POLYMER SOLUTION, CONDUCTIVE COATING FILM AND INPUT DEVICE | SHIN-ETSU POLYMER CO., LTD. (JP) | 2011-07-21 | — | — | US | disclosed |
| CN-1639282-A | Varnish containing polyamide resin and use thereof | NIPPON KAYAKU KK (JP) | 2005-07-13 | — | — | CN | disclosed |
| EP-0749266-B1 | Transparent heater panels and method of making them | MITSUI CHEMICALS INC (JP) | 2002-05-29 | — | — | EP | disclosed |
| US-5911899-A | Corrosion-proof transparent heater panels and preparation process thereof | MITSUI CHEMICALS, INC. (JP) | 1999-06-15 | — | — | US | disclosed |
| EP-0749266-A2 | Transparent heater panels and method of making them | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1996-12-18 | — | — | EP | disclosed |
| US-5166229-A | Polyamide wax, a castor oil wax, a sorbitol derivative and an amino acid derivative for adhesion strength, heat resistance and waterproofing | SUNSTAR GIKEN KUBUSHIKI KAISHA (JP) | 1992-11-24 | — | — | US | disclosed |
| US-4829134-A | OXAZOLINE | KABUSHIKI KAISHA TOSHIBA (JP) | 1989-05-09 | — | — | US | disclosed |
| US-4568727-A | LATENT CURING OF ADDUCT WITH DIAMINODIARYLALKANE | RUTGERSWERKE AKTIENGESELLSCHAFT (DE) | 1986-02-04 | — | — | US | disclosed |
| US-4358552-A | Epoxy resinous molding compositions having low coefficient of thermal expansion and high thermal conductivity | MORTON-NORWICH PRODUCTS, INC. (US) | 1982-11-09 | — | — | US | disclosed |