SCHEMBL2038141

SCHEMBL2038141

CCCCCCCCOI(c1ccccc1)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LTA4H P09960 2/20 0.46
▸ TSHR P16473 4/20 0.43
▸ LMNA P02545 3/20 0.43
▸ ALDH1A1 P00352 3/20 0.43
▸ CYP3A4 P08684 3/20 0.41
▸ MAPK1 P28482 2/20 0.41
▸ TP53 P04637 2/20 0.41
▸ NR1I2 O75469 2/20 0.40
▸ CHRM2 P08172 2/20 0.40
▸ ADRA2A P08913 2/20 0.40
▸ OPRK1 P41145 2/20 0.40
▸ HTR2B P41595 2/20 0.40
▸ SLC6A3 Q01959 2/20 0.40
▸ MLNR O43193 1/20 0.40
▸ ESR1 P03372 1/20 0.40
▸ NR3C1 P04150 1/20 0.40
▸ PGR P06401 1/20 0.40
▸ ADRB2 P07550 1/20 0.40
▸ ADRB1 P08588 1/20 0.40
▸ HTR1A P08908 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1598549 0.92 LTA4H (0.47) LTA4HTSHRALDH1A1CYP3A4MAPK1
SCHEMBL4631521 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL173285 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL9342022 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL896464 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL25205847 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL10698722 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL11478870 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL1517457 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4
SCHEMBL93803 0.71 LTA4H (0.81) LTA4HTSHRLMNAALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8698320-B2 Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices Henkel IP & Holding GmbH (DE) 2014-04-15 — — US disclosed
US-20110133344-A1 CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES HENKEL CORPORATION (US) 2011-06-09 — — US disclosed
US-20090107632-A1 ADHESIVE COMPOSITIONS FOR HIGH TEMPERATURE SENSORS AND METHODS OF MAKING THE SAME GENERAL ELECTRIC COMPANY (US) 2009-04-30 — — US disclosed
EP-1309645-A2 USE OF CROSS-LINKER AND COMPOSITIONS MADE THEREFROM UCB S.A. (BE) 2003-05-14 — — EP disclosed
WO-2002008309-A2 USE OF CROSS-LINKER AND COMPOSITIONS MADE THEREFROM UCB S.A. (BE) 2002-01-31 — — WO disclosed
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