Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP4F2 | P78329 | 1/20 | 0.32 |
| ▸ | CYP4A11 | Q02928 | 1/20 | 0.32 |
| ▸ | SIGMAR1 | Q99720 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17976527 | 0.83 | NAAA (0.41) | — | |
| SCHEMBL2678283 | 0.83 | NAAA (0.41) | — | |
| SCHEMBL454844 | 0.77 | NAAA (0.46) | — | |
| SCHEMBL10494391 | 0.77 | NAAA (0.46) | — | |
| SCHEMBL15654 | 0.77 | NAAA (0.46) | — | |
| Hydrogen Sulfide SCHEMBL28085415 | 0.76 | NAAA (0.44) | — | |
| SCHEMBL703883 | 0.71 | CYP4F2 (0.33) | CYP4F2CYP4A11 | |
| SCHEMBL8973996 | 0.70 | PRKCA (0.33) | — | |
| SCHEMBL2044453 | 0.68 | CYP4F2 (0.35) | CYP4F2CYP4A11 | |
| SCHEMBL181588 | 0.67 | CYP2C19 (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024010080-A1 | UV-CURABLE PRINTING INK COMPOSITION, AND PRODUCTION METHOD AND CURED COATING FILM OF SAME | 株式会社カネカ | 2024-01-11 | — | — | WO | disclosed |
| WO-2023248932-A1 | GREEN SHEET AND SINTERED COMPACT, AND METHODS FOR PRODUCING THOSE | ＡＧＣ株式会社 | 2023-12-28 | — | — | WO | disclosed |
| US-20230365734-A1 | LATEX AND RESIN COMPOSITION, AND METHODS FOR PRODUCING SAME | KANEKA CORPORATION (JP) | 2023-11-16 | — | — | US | disclosed |
| WO-2023190135-A1 | STRESS REDUCING AGENT AND RESIN COMPOSITION | 株式会社カネカ | 2023-10-05 | — | — | WO | disclosed |
| WO-2023190466-A1 | MODIFIER FOR POLYACETAL RESIN, POLYACETAL RESIN COMPOSITION, AND METHOD FOR PRODUCING MODIFIER FOR POLYACETAL RESIN | 株式会社カネカ | 2023-10-05 | — | — | WO | disclosed |
| EP-4223810-A1 | LATEX AND RESIN COMPOSITION, AND METHODS FOR PRODUCING SAME | Kaneka Corporation (JP) | 2023-08-09 | — | — | EP | disclosed |
| EP-3904453-B1 | RESIN COMPOSITION AND USE FOR SAME | KANEKA CORP (JP) | 2023-05-10 | — | — | EP | disclosed |
| US-20220213311-A1 | PARTICULATE AND METHOD FOR PRODUCING PARTICULATE | KANEKA CORPORATION (JP) | 2022-07-07 | — | — | US | disclosed |
| EP-3995527-A1 | MOLDED BODY INCLUDING POLYCARBONATE-BASED RESIN COMPOSITION | Idemitsu Kosan Co.,Ltd. (JP) | 2022-05-11 | — | — | EP | disclosed |
| EP-3995540-A1 | POLYCARBONATE RESIN COMPOSITION | Idemitsu Kosan Co.,Ltd. (JP) | 2022-05-11 | — | — | EP | disclosed |
| EP-2810991-B1 | POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE | IDEMITSU KOSAN CO (JP) | 2017-09-20 | — | — | EP | disclosed |
| EP-3173434-A1 | THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF | MITSUBISHI CHEMICAL CORPORATION (JP) | 2017-05-31 | — | — | EP | disclosed |
| US-20170130006-A1 | THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF | MITSUBISHI CHEMICAL CORPORATION (JP) | 2017-05-11 | — | — | US | disclosed |
| US-9499694-B2 | Polycarbonate resin composition and molded article | IDEMITSU KOSAN CO., LTD. (JP) | 2016-11-22 | — | — | US | disclosed |
| US-20150086907-A1 | PHOTOSENSITIVE COMPOSITION FOR VOLUME HOLOGRAM RECORDING, VOLUME HOLOGRAM RECORDING MEDIUM USING SAME, METHOD FOR MANUFACTURING VOLUME HOLOGRAM RECORDING MEDIUM, AND HOLOGRAM RECORDING METHOD | DAICEL CORPORATION (JP) | 2015-03-26 | — | — | US | disclosed |
| EP-2810991-A1 | POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE | Idemitsu Kosan Co., Ltd (JP) | 2014-12-10 | — | — | EP | disclosed |
| US-20140343200-A1 | POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE | IDEMITSU KOSAN CO., LTD. (JP) | 2014-11-20 | — | — | US | disclosed |
| EP-2093074-B1 | Eraser | TOMBOW PENCIL (JP) | 2011-06-01 | — | — | EP | disclosed |
| EP-2093074-A2 | Eraser | TOMBOW PENCIL CO., LTD. (JP) | 2009-08-26 | — | — | EP | disclosed |
| US-20090209686-A1 | Eraser | TOMBOW PENCIL CO., LTD. (JP) | 2009-08-20 | — | — | US | disclosed |