SCHEMBL204690

SCHEMBL204690

NCOCCOCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL203882 0.95 MEN1 (0.38)
SCHEMBL254201 0.95 MEN1 (0.38)
SCHEMBL16687462 0.84
SCHEMBL20994048 0.84 ODC1 (0.35)
SCHEMBL15743532 0.84 ODC1 (0.35)
SCHEMBL3439517 0.82
SCHEMBL5932911 0.82
SCHEMBL1271650 0.82
SCHEMBL18902685 0.79 CA2 (0.41)
SCHEMBL21984970 0.79 ALDH1A1 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 248 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12504687-B2 Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2025-12-23 US disclosed
US-20250346020-A1 LAMINATE AND DISPLAY KANEKA CORPORATION (JP) 2025-11-13 US disclosed
US-20250320338-A1 TRANSPARENT FILM, HARD COAT FILM, AND DISPLAY KANEKA CORPORATION (JP) 2025-10-16 US disclosed
CN-119948089-A Hard coating film and display 株式会社钟化 2025-05-06 CN disclosed
WO-2025074873-A1 POLYAMIDIMIDE, RESIN COMPOSITION, MOLDED ARTICLE, AND FILM 株式会社カネカ 2025-04-10 WO disclosed
CN-119775953-A Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board 荒川化学工业株式会社 2025-04-08 CN disclosed
US-20250109264-A1 FILM, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE KANEKA CORPORATION (JP) 2025-04-03 US disclosed
WO-2025063230-A1 POLYIMIDE, RESIN COMPOSITION, MOLDED OBJECT, AND FILM 株式会社カネカ 2025-03-27 WO disclosed
US-12234323-B2 Transparent polyimide film and production method therefor KANEKA CORPORATION (JP) 2025-02-25 US disclosed
CN-119403881-A Resin composition, molded article, and film 株式会社钟化 2025-02-07 CN disclosed
US-6710160-B2 VARNISH HAVING IMPROVED SMOOTHNESS, THERMAL RESISTANCE, MELT FLOWABILITY, OPTICAL PROPERTIES AND CHEMICAL RESISTANCE; DIELECTRICS MITSUI CHEMICALS, INC. (JP) 2004-03-23 US disclosed
US-6599675-B2 Useful for application of photoresist, as an insulation film; heat resistance, mechanical properties and adhesion property MITSUI CHEMICALS, INC. (JP) 2003-07-29 US disclosed
EP-1321487-A1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE Mitsui Chemicals, Inc. (JP) 2003-06-25 EP disclosed
US-20030064235-A1 Optical members made of polymide resins MITSUI CHEMICALS, INC. (JP) 2003-04-03 US disclosed
US-6531568-B1 Melt processable thermoplastic resins formed from chemical intermediates such as polyamic acids having chemical, heat, oxidation and radiation resistance MITSUI CHEMICALS, INC. (JP) 2003-03-11 US disclosed
US-20020188090-A1 Polyamic acid, polyimide, process for producing these, and film of the polyimide MITSUI CHEMICALS, INC. (JP) 2002-12-12 US disclosed
US-20020182536-A1 Polyimides and polyamic acids MITSUI CHEMICALS, INC. (JP) 2002-12-05 US disclosed
EP-1237015-A1 OPTICAL MEMBERS MADE OF POLYIMIDE RESINS Mitsui Chemicals, Inc. (JP) 2002-09-04 EP disclosed
EP-1225192-A1 POLYIMIDES AND POLYAMIC ACIDS Mitsui Chemicals, Inc. (JP) 2002-07-24 EP disclosed
EP-1148078-A1 POLYIMIDE CONTAINING CROSSLINKABLE GROUP AND PROCESS FOR PRODUCING THE SAME Mitsui Chemicals, Inc. (JP) 2001-10-24 EP disclosed