Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28243648 | 0.82 | ALDH1A1 (0.31) | ALDH1A1TSHRLMNAHSD17B10TDP1 | |
| SCHEMBL11294314 | 0.82 | ALDH1A1 (0.31) | ALDH1A1TSHRLMNAHSD17B10TDP1 | |
| Acetic Acid SCHEMBL28764934 | 0.80 | — | — | |
| SCHEMBL1008696 | 0.80 | — | — | |
| SCHEMBL566286 | 0.77 | — | — | |
| SCHEMBL2226503 | 0.77 | — | — | |
| SCHEMBL14086859 | 0.76 | — | — | |
| SCHEMBL454137 | 0.76 | — | — | |
| SCHEMBL2877989 | 0.75 | — | — | |
| Bicarbonate SCHEMBL29165357 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-11150556-B2 | Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-19 | — | — | US | disclosed |
| EP-3398983-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-11-07 | — | — | EP | disclosed |
| US-20180275513-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-09-27 | — | — | US | disclosed |