SCHEMBL20514337

SCHEMBL20514337

C#CCCOCCCCS(=O)(=O)O

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.39
CA9 Q16790 1/20 0.39
APP P05067 1/20 0.35
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL37545 0.83 APP (0.48) CA2CA9APPTSHR
SCHEMBL20514341 0.82 TSHR (0.50) APPTSHR
SCHEMBL30133577 0.81 APP (0.46) CA2CA9APPTSHR
SCHEMBL30782568 0.81 APP (0.46) CA2CA9APPTSHR
SCHEMBL312671 0.81 APP (0.46) CA2CA9APPTSHR
SCHEMBL419968 0.81 APP (0.46) CA2CA9APPTSHR
SCHEMBL18380848 0.81 APP (0.46) CA2CA9APPTSHR
SCHEMBL754172 0.81 APP (0.46) CA2CA9APPTSHR
Bromide SCHEMBL31659017 0.81 APP (0.46) CA2CA9APPTSHR
SCHEMBL754168 0.81 APP (0.46) CA2CA9APPTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108291307-B Plating bath composition and method for electroless plating of palladium 埃托特克德国有限公司 2020-02-14 CN claimed
US-10513780-B2 Plating bath composition and method for electroless plating of palladium ATOTECH DEUTSCHLAND GMBH (DE) 2019-12-24 US claimed
EP-3380649-B1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH (DE) 2019-10-30 EP claimed
US-20180340260-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2018-11-29 US claimed
EP-3380649-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH Deutschland GmbH (DE) 2018-10-03 EP claimed
CN-108291307-B Plating bath composition and method for electroless plating of palladium 埃托特克德国有限公司 2020-02-14 CN disclosed
US-10513780-B2 Plating bath composition and method for electroless plating of palladium ATOTECH DEUTSCHLAND GMBH (DE) 2019-12-24 US disclosed
EP-3380649-B1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH (DE) 2019-10-30 EP disclosed
US-20180340260-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2018-11-29 US disclosed
EP-3380649-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH Deutschland GmbH (DE) 2018-10-03 EP disclosed