SCHEMBL20514341

SCHEMBL20514341

C#CCOCCCCS(=O)(=O)O

nearest known ligand 0.50

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.50
APP P05067 1/20 0.37
PTGS1 P23219 1/20 0.30
PDE4A P27815 1/20 0.30
LMNA P02545 1/20 0.30
SLC6A6 P31641 1/20 0.30
CYP2C19 P33261 1/20 0.30
BLM P54132 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5706221 0.94 TSHR (0.52) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL15412880 0.92 TSHR (0.50) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL11079760 0.85 TSHR (0.45) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL20514337 0.82 CA2 (0.39) TSHRAPP
SCHEMBL37545 0.80 APP (0.48) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL20514343 0.78 TSHR (0.44) TSHRLMNA
SCHEMBL754172 0.78 APP (0.46) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL419968 0.78 APP (0.46) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL312671 0.78 APP (0.46) TSHRAPPPTGS1PDE4ALMNA
SCHEMBL18380848 0.78 APP (0.46) TSHRAPPPTGS1PDE4ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108291307-B Plating bath composition and method for electroless plating of palladium 埃托特克德国有限公司 2020-02-14 CN claimed
US-10513780-B2 Plating bath composition and method for electroless plating of palladium ATOTECH DEUTSCHLAND GMBH (DE) 2019-12-24 US claimed
EP-3380649-B1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH (DE) 2019-10-30 EP claimed
US-20180340260-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2018-11-29 US claimed
EP-3380649-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH Deutschland GmbH (DE) 2018-10-03 EP claimed
CN-108291307-B Plating bath composition and method for electroless plating of palladium 埃托特克德国有限公司 2020-02-14 CN disclosed
US-10513780-B2 Plating bath composition and method for electroless plating of palladium ATOTECH DEUTSCHLAND GMBH (DE) 2019-12-24 US disclosed
EP-3380649-B1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH (DE) 2019-10-30 EP disclosed
US-20180340260-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) 2018-11-29 US disclosed
EP-3380649-A1 PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM ATOTECH Deutschland GmbH (DE) 2018-10-03 EP disclosed