Methacrylic Acid

Methacrylic Acid

SCHEMBL2052203

C=C(C)C(=O)O.CCCCCNC(=O)OCC

nearest known ligand 0.55

Full drug profile on Sugi Atlas →

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ACHE P22303 12/20 0.53
EPHX1 P07099 1/20 0.53
FAAH O00519 1/20 0.46
EPHX2 P34913 2/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methacrylic Acid SCHEMBL28074000 0.88 ACHE (0.44) ACHE
SCHEMBL590897 0.88 ACHE (0.67) ACHEEPHX1
Methacrylic Acid SCHEMBL31735092 0.87 ACHE (0.49) ACHE
Methacrylic Acid SCHEMBL8928145 0.87 ACHE (0.49) ACHE
SCHEMBL28986129 0.86 EPHX1 (0.70) ACHEEPHX1
SCHEMBL2987259 0.86 EPHX1 (0.70) ACHEEPHX1
SCHEMBL4647121 0.86 EPHX1 (0.70) ACHEEPHX1
SCHEMBL30557165 0.86 EPHX1 (0.70) ACHEEPHX1
SCHEMBL2987477 0.86 EPHX1 (0.70) ACHEEPHX1
SCHEMBL5696599 0.86 EPHX1 (0.70) ACHEEPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4380990-A1 DUAL-CURE RESIN COMPOSITION COMPRISING URETDIONE-CONTAINING COMPOUND AND ITS USE IN 3D PRINTING BASF SE (DE) 2024-06-12 EP disclosed
WO-2024033289-A1 A PHOTOCURABLE OLIGOMER CONTAINING URETDIONE GROUPS, METHOD OF PREPARING THE OLIGOMER AND DUAL-CURE RESIN COMPOSITION CONTAINING THE OLIGOMER THEREOF BASF SE (DE) 2024-02-15 WO disclosed
WO-2023012000-A1 DUAL-CURE RESIN COMPOSITION COMPRISING URETDIONE-CONTAINING COMPOUND AND ITS USE IN 3D PRINTING BASF SE (DE) 2023-02-09 WO disclosed
US-20220002559-A1 COATINGS FOR WATERPROOFING ELECTRONIC COMPONENTS HENKEL AG & CO. KGAA (DE) 2022-01-06 US disclosed
WO-2020197963-A1 COATINGS FOR WATERPROOFING ELECTRONIC COMPONENTS HENKEL AG & CO. KGAA (DE) 2020-10-01 WO disclosed
US-10711168-B2 Process for assembling elements containing biological substances SICPA HOLDING SA (CH) 2020-07-14 US disclosed
US-10273370-B2 Composition forming an insulating layer and use of said composition HILTI AKTIENGESELLSCHAFT (LI) 2019-04-30 US disclosed
US-20180340075-A1 NANO-COMPOSITE ANTI-FINGERPRINT COATING HENKEL AG & CO. KGAA (DE) 2018-11-29 US disclosed
EP-3397697-A1 NANO-COMPOSITE ANTI-FINGERPRINT COATING Henkel AG & Co. KGaA (DE) 2018-11-07 EP disclosed
EP-2512674-B1 PROCESS FOR ASSEMBLING ELEMENTS CONTAINING BIOLOGICAL SUBSTANCES SICPA HOLDING SA (CH) 2018-04-04 EP disclosed
WO-2017116786-A1 NANO-COMPOSITE ANTI-FINGERPRINT COATING HENKEL AG & CO. KGAA (DE) 2017-07-06 WO disclosed
US-20170130105-A1 PROCESS FOR ASSEMBLING ELEMENTS CONTAINING BIOLOGICAL SUBSTANCES SICPA HOLDING SA (CH) 2017-05-11 US disclosed
US-20170130066-A1 Fire Protection Composition and Use Thereof HILTI AKTIENGESELLSCHAFT (LI) 2017-05-11 US disclosed
US-20160068689-A1 Composition Forming an Insulating Layer and Use of Said Composition HILTI AKTIENGESELLSCHAFT (LI) 2016-03-10 US disclosed
EP-2512674-A1 PROCESS FOR ASSEMBLING ELEMENTS CONTACTING BIOLOGICAL SUBSTANCES OLIVETTI S.p.A. (IT) 2012-10-24 EP disclosed
US-20120248103-A1 PROCESS FOR ASSEMBLING ELEMENTS CONTAINING BIOLOGICAL SUBSTANCES OLIVETTI I-JET S.P.A. (IT) 2012-10-04 US disclosed
WO-2011072715-A1 PROCESS FOR ASSEMBLING ELEMENTS CONTACTING BIOLOGICAL SUBSTANCES TELECOM ITALIA S.P.A. (IT) 2011-06-23 WO disclosed