⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28254931 | 0.74 | — | — | |
| SCHEMBL20533472 | 0.74 | THRB (0.35) | — | |
| SCHEMBL11539460 | 0.72 | HTT (0.33) | — | |
| SCHEMBL11539456 | 0.72 | HTT (0.33) | — | |
| SCHEMBL9561634 | 0.70 | HTT (0.35) | — | |
| SCHEMBL9872537 | 0.70 | HTT (0.39) | — | |
| SCHEMBL20536672 | 0.70 | TDP1 (0.42) | — | |
| SCHEMBL9872540 | 0.70 | HTT (0.39) | — | |
| SCHEMBL9561630 | 0.70 | HTT (0.35) | — | |
| SCHEMBL25406776 | 0.69 | TSHR (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021075483-A1 | OPTICAL BONDING PARTICLES, ADHESIVE, AND DISPLAY DEVICE | 積水化学工業株式会社 | 2021-04-22 | — | — | WO | disclosed |
| WO-2021025114-A1 | RESIN PARTICLE, ELECTROCONDUCTIVE PARTICLE, ELECTROCONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE | 積水化学工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021025112-A1 | RESIN PARTICLE, ELECTRICALLY CONDUCTIVE PARTICLE, ELECTRICALLY CONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE | 積水化学工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021025113-A1 | RESIN PARTICLE, ELECTROCONDUCTIVE PARTICLE, ELECTROCONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE | 積水化学工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2020189697-A1 | RESIN PARTICLES, CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE | 積水化学工業株式会社 | 2020-09-24 | — | — | WO | disclosed |
| US-20180318970-A1 | PARTICLES, CONNECTING MATERIAL AND CONNECTION STRUCTURE | SEKISUI CHEMICAL CO., LTD. (JP) | 2018-11-08 | — | — | US | disclosed |