Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31498812 | 0.84 | THRB (0.31) | THRB | |
| SCHEMBL13876977 | 0.77 | THRB (0.36) | THRBLMNA | |
| SCHEMBL873736 | 0.77 | THRB (0.36) | THRBLMNA | |
| SCHEMBL873737 | 0.77 | THRB (0.36) | THRBLMNA | |
| SCHEMBL20550244 | 0.74 | — | — | |
| SCHEMBL21225089 | 0.73 | THRB (0.33) | THRBLMNA | |
| SCHEMBL13480690 | 0.73 | TRPA1 (0.35) | THRBLMNA | |
| SCHEMBL7753833 | 0.73 | LMNA (0.38) | THRBLMNA | |
| SCHEMBL7754960 | 0.73 | LMNA (0.38) | THRBLMNA | |
| SCHEMBL7754963 | 0.73 | LMNA (0.38) | THRBLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022131319-A1 | ADHESIVE PARTICLES, ADHESIVE AND LIGHT-MODULATING LAMINATE | 積水化学工業株式会社 | 2022-06-23 | — | — | WO | disclosed |
| WO-2022131318-A1 | ADHESIVE PARTICLES, ADHESIVE AND LIGHT-MODULATING LAMINATE | 積水化学工業株式会社 | 2022-06-23 | — | — | WO | disclosed |
| CN-111534149-B | High-adhesion ink and preparation method thereof | 厦门欧化实业有限公司 | 2022-06-03 | — | — | CN | disclosed |
| US-11020825-B2 | Connecting material and connection structure | SEKISUI CHEMICAL CO., LTD. (JP) | 2021-06-01 | — | — | US | disclosed |
| WO-2021075483-A1 | OPTICAL BONDING PARTICLES, ADHESIVE, AND DISPLAY DEVICE | 積水化学工業株式会社 | 2021-04-22 | — | — | WO | disclosed |
| WO-2021025114-A1 | RESIN PARTICLE, ELECTROCONDUCTIVE PARTICLE, ELECTROCONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE | 積水化学工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021025113-A1 | RESIN PARTICLE, ELECTROCONDUCTIVE PARTICLE, ELECTROCONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE | 積水化学工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021025112-A1 | RESIN PARTICLE, ELECTRICALLY CONDUCTIVE PARTICLE, ELECTRICALLY CONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE | 積水化学工業株式会社 | 2021-02-11 | — | — | WO | disclosed |
| WO-2020189697-A1 | RESIN PARTICLES, CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE | 積水化学工業株式会社 | 2020-09-24 | — | — | WO | disclosed |
| US-20180297153-A1 | CONNECTING MATERIAL AND CONNECTION STRUCTURE | SEKISUI CHEMICAL CO., LTD. (JP) | 2018-10-18 | — | — | US | disclosed |