Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.58 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.58 |
| ▸ | HPGD | P15428 | 2/20 | 0.48 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.48 |
| ▸ | CES2 | O00748 | 1/20 | 0.48 |
| ▸ | CES1 | P23141 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.45 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.45 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.45 |
| ▸ | HTT | P42858 | 2/20 | 0.44 |
| ▸ | POLB | P06746 | 2/20 | 0.44 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 1/20 | 0.44 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | GAA | P10253 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19325393 | 1.00 | HDAC8 (0.58) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL7056987 | 0.87 | HDAC8 (0.67) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL11291275 | 0.78 | HDAC8 (0.55) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL917236 | 0.78 | HDAC8 (0.56) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL20427412 | 0.78 | HDAC8 (0.56) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL23091318 | 0.78 | MAPT (0.57) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL8332232 | 0.78 | HDAC8 (0.56) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL20787869 | 0.78 | HDAC8 (0.56) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL6185998 | 0.78 | HDAC8 (0.50) | HDAC8HDAC6HPGDEPHX1CES2 | |
| SCHEMBL11117455 | 0.76 | CES2 (0.44) | HDAC8HDAC6HPGDEPHX1CES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| CN-119998728-A | Film manufacturing method, photosensitive resin composition, cured product manufacturing method, cured product, and laminate | 富士胶片株式会社 | 2025-05-13 | — | — | CN | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| CN-114981360-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-09-10 | — | — | CN | disclosed |
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| WO-2024070963-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | 富士フイルム株式会社 | 2024-04-04 | — | — | WO | disclosed |
| EP-4317287-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2024-02-07 | — | — | EP | disclosed |
| CN-117099045-A | Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-11-21 | — | — | CN | disclosed |
| CN-113820920-B | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-115185157-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2022-10-14 | — | — | CN | disclosed |
| WO-2021132578-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-07-01 | — | — | WO | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| WO-2020143198-A1 | KETAMINE DERIVATIVES AND COMPOSITIONS THEREOF | XW LABORATORIES INC. (KY) | 2020-07-16 | — | — | WO | disclosed |
| US-10354932-B2 | Semiconductor device including semiconductor element and redistribution layer electrically connected thereto, and method of manufacturing the device | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-07-16 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-20180342432-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-11-29 | — | — | US | disclosed |
| CN-107850844-A | Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device | 旭化成株式会社 | 2018-03-27 | — | — | CN | disclosed |
| CN-100549828-C | Positive photosensitive resin composition | ASAHI KASEI EMD CORP (JP) | 2009-10-14 | — | — | CN | disclosed |
| CN-1820228-A | Positive photosensitive resin composition | ASAHI KASEI EMD CORP (JP) | 2006-08-16 | — | — | CN | disclosed |