Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | CES2 | O00748 | 3/20 | 0.35 |
| ▸ | GMNN | O75496 | 1/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | THRB | P10828 | 1/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.35 |
| ▸ | BLM | P54132 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | FAAH | O00519 | 4/20 | 0.30 |
| ▸ | CES1 | P23141 | 4/20 | 0.30 |
| ▸ | PLA2G6 | O60733 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2058555 | 1.00 | TDP1 (0.35) | TDP1CES2GMNNTP53POLB | |
| SCHEMBL2058544 | 1.00 | TDP1 (0.35) | TDP1CES2GMNNTP53POLB | |
| SCHEMBL28427276 | 1.00 | TDP1 (0.35) | TDP1CES2GMNNTP53POLB | |
| SCHEMBL2058567 | 1.00 | TDP1 (0.35) | TDP1CES2GMNNTP53POLB | |
| SCHEMBL2058166 | 0.96 | TDP1 (0.38) | TDP1CES2GMNNTP53POLB | |
| SCHEMBL28238413 | 0.90 | LMNA (0.38) | TDP1CES2GMNNTP53POLB | |
| SCHEMBL2058366 | 0.88 | — | — | |
| SCHEMBL26982673 | 0.85 | CES2 (0.54) | CES2GMNNTP53POLBMAPT | |
| SCHEMBL7828894 | 0.85 | — | — | |
| SCHEMBL8308958 | 0.85 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11643742-B2 | Silver/tin electroplating bath and method of using the same | MACDERMID ENTHONE INC. (US) | 2023-05-09 | — | — | US | claimed |
| EP-4162100-A1 | SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME | MacDermid Enthone Inc. (US) | 2023-04-12 | — | — | EP | claimed |
| CN-115605635-A | Silver/tin electroplating bath and method of use | 麦克德米德乐思公司（US） | 2023-01-13 | — | — | CN | claimed |
| US-20220170172-A1 | Silver/Tin Electroplating Bath and Method of Using the Same | MACDERMID ENTHONE INC (US) | 2022-06-02 | — | — | US | claimed |
| US-11280014-B2 | Silver/tin electroplating bath and method of using the same | MACDERMID ENTHONE INC. (US) | 2022-03-22 | — | — | US | claimed |
| US-20210381121-A1 | Silver/Tin Electroplating Bath and Method of Using the Same | MACDERMID ENTHONE INC. | 2021-12-09 | — | — | US | claimed |
| EP-3004429-B1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | ROHM & HAAS ELECT MAT (US) | 2018-07-18 | — | — | EP | claimed |
| EP-3816325-B1 | ACIDIC AQUEOUS SILVER-NICKEL ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) | 2025-05-07 | — | — | EP | disclosed |
| CN-112663101-B | Acidic aqueous silver-nickel alloy electroplating compositions and methods | 罗门哈斯电子材料有限责任公司 | 2024-09-20 | — | — | CN | disclosed |
| US-11643742-B2 | Silver/tin electroplating bath and method of using the same | MACDERMID ENTHONE INC. (US) | 2023-05-09 | — | — | US | disclosed |
| EP-4162100-A1 | SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME | MacDermid Enthone Inc. (US) | 2023-04-12 | — | — | EP | disclosed |
| CN-115605635-A | Silver/tin electroplating bath and method of use | 麦克德米德乐思公司（US） | 2023-01-13 | — | — | CN | disclosed |
| EP-4098778-A1 | ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2022-12-07 | — | — | EP | disclosed |
| EP-2910667-A1 | CYANIDE-FREE ACIDIC MATTE SILVER ELECTROPLATING COMPOSITIONS AND METHODS | Rohm and Haas Electronic Materials LLC (US) | 2015-08-26 | — | — | EP | disclosed |
| US-20140353162-A1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2014-12-04 | — | — | US | disclosed |
| WO-2014165867-A1 | ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2014-10-09 | — | — | WO | disclosed |
| US-7968444-B2 | Lead-free tin alloy electroplating compositions and methods | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2011-06-28 | — | — | US | disclosed |
| US-20100216302-A1 | Lead-free tin alloy electroplating compositions and methods | ROHM AND HAAS ELECTRONICS MATERIALS LLC (US) | 2010-08-26 | — | — | US | disclosed |
| EP-2221396-A1 | Lead-Free Tin Alloy Electroplating Compositions and Methods | Rohm and Haas Electronic Materials LLC (US) | 2010-08-25 | — | — | EP | disclosed |
| US-5162585-A | Preparation of dihydroxy bis-sulfides | PHILLIPS PETROLEUM COMPANY (US) | 1992-11-10 | — | — | US | disclosed |