Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28364973 | 1.00 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL6545746 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL2337584 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL17513048 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580570 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL3081554 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL14801789 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580471 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580451 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580373 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10711160-B2 | Slurry compositions for polishing a metal layer and methods for fabricating semiconductor devices using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-07-14 | — | — | US | claimed |
| US-20180355213-A1 | Slurry Compositions for Polishing a Metal Layer and Methods for Fabricating Semiconductor Devices Using the Same | KCTECH CO.,LTD. (KR) | 2018-12-13 | — | — | US | claimed |
| CN-115012953-A | Grouting reinforcement process and equipment for water-rich flowing sand surrounding rock in coal mine or tunnel engineering | 北京瑞诺安科新能源技术有限公司 | 2022-09-06 | — | — | CN | disclosed |
| US-10711160-B2 | Slurry compositions for polishing a metal layer and methods for fabricating semiconductor devices using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-07-14 | — | — | US | disclosed |
| CN-109021833-A | The method of paste compound and production semiconductor device for polishing metal layer | 三星电子株式会社 | 2018-12-18 | — | — | CN | disclosed |
| US-20180355213-A1 | Slurry Compositions for Polishing a Metal Layer and Methods for Fabricating Semiconductor Devices Using the Same | KCTECH CO.,LTD. (KR) | 2018-12-13 | — | — | US | disclosed |