Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL30909566 | 0.92 | — | — | |
| SCHEMBL17513048 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580451 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL2337584 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580373 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL3081554 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL14801789 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580591 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580471 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 | |
| SCHEMBL20580570 | 0.91 | MEN1 (0.33) | MEN1ALDH1A1TSHRKMT2ACA2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111533841-B | High-adhesion high-temperature-resistant water-based alumite back adhesive resin and preparation method thereof | 宿迁市万尚新材料科技股份有限公司 | 2022-05-20 | — | — | CN | claimed |
| CN-109264767-B | Method for preparing nano structure at low temperature | 上海交通大学 | 2022-01-14 | — | — | CN | claimed |
| CN-111533841-A | High-adhesion high-temperature-resistant water-based alumite back adhesive resin and preparation method thereof | 宿迁市万尚新材料科技有限公司 | 2020-08-14 | — | — | CN | claimed |
| US-10711160-B2 | Slurry compositions for polishing a metal layer and methods for fabricating semiconductor devices using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-07-14 | — | — | US | claimed |
| US-20180355213-A1 | Slurry Compositions for Polishing a Metal Layer and Methods for Fabricating Semiconductor Devices Using the Same | KCTECH CO.,LTD. (KR) | 2018-12-13 | — | — | US | claimed |
| CN-119581509-A | Negative electrode material, preparation method thereof and battery | 江苏正力新能电池技术股份有限公司 | 2025-03-07 | — | — | CN | disclosed |
| CN-117328049-A | Polymer conductive microsphere chemical coating production process for liquid crystal display | 江西贵得科技有限公司 | 2024-01-02 | — | — | CN | disclosed |
| CN-114456267-B | anti-CD 73 humanized monoclonal antibody and application thereof | 浙江大学医学院附属第二医院 | 2023-12-01 | — | — | CN | disclosed |
| CN-116920909-A | Preparation method of foam nickel-loaded magnetic recyclable persulfate activator, product and application thereof | 上海纳米技术及应用国家工程研究中心有限公司 | 2023-10-24 | — | — | CN | disclosed |
| CN-115011989-A | Nickel-manganese nitride catalyst and preparation method and application thereof | 武汉工程大学 | 2022-09-06 | — | — | CN | disclosed |
| CN-111533841-B | High-adhesion high-temperature-resistant water-based alumite back adhesive resin and preparation method thereof | 宿迁市万尚新材料科技股份有限公司 | 2022-05-20 | — | — | CN | disclosed |
| CN-114456267-A | anti-CD 73 humanized monoclonal antibody and application thereof | 浙江大学医学院附属第二医院 | 2022-05-10 | — | — | CN | disclosed |
| CN-109023441-B | Method for electroplating nickel coating on surface of metal tantalum or tantalum coating | 中国科学院金属研究所 | 2021-01-05 | — | — | CN | disclosed |
| CN-111533841-A | High-adhesion high-temperature-resistant water-based alumite back adhesive resin and preparation method thereof | 宿迁市万尚新材料科技有限公司 | 2020-08-14 | — | — | CN | disclosed |
| US-10711160-B2 | Slurry compositions for polishing a metal layer and methods for fabricating semiconductor devices using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2020-07-14 | — | — | US | disclosed |
| CN-109021833-A | The method of paste compound and production semiconductor device for polishing metal layer | 三星电子株式会社 | 2018-12-18 | — | — | CN | disclosed |
| US-20180355213-A1 | Slurry Compositions for Polishing a Metal Layer and Methods for Fabricating Semiconductor Devices Using the Same | KCTECH CO.,LTD. (KR) | 2018-12-13 | — | — | US | disclosed |
| US-20040079642-A1 | Method and device for recovering metals by means of pulsating cathode currents also in combination with anodic coproduction processes | THIELE WOLFGANG (DE) | 2004-04-29 | — | — | US | disclosed |
| EP-1379712-A2 | METHOD AND DEVICE FOR RECOVERING METALS WITH PULSATING CATHODE CURRENTS ALSO COMBINED WITH ANODE COUPLING PROCESSES | EILENBURGER ELEKTROLYSE- UND UMWELTTECHNIK GMBH (DE) | 2004-01-14 | — | — | EP | disclosed |
| WO-2002072921-A2 | METHOD AND DEVICE FOR RECOVERING METALS WITH PULSATING CATHODE CURRENTS ALSO COMBINED WITH ANODE COUPLING PROCESSES | EILENBURGER ELEKTROLYSE-UND UMWELTTECHNIK GMBH (DE) | 2002-09-19 | — | — | WO | disclosed |