SCHEMBL2058205

SCHEMBL2058205

OCSCCSCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9787668 0.95 TDP1 (0.50)
SCHEMBL8781815 0.82
SCHEMBL2058366 0.82
SCHEMBL2058166 0.82 TDP1 (0.38)
SCHEMBL1471346 0.82
SCHEMBL17208098 0.82
SCHEMBL2058045 0.79 TDP1 (0.35)
SCHEMBL2058555 0.79 TDP1 (0.35)
SCHEMBL2058567 0.79 TDP1 (0.35)
SCHEMBL2909708 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11643742-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2023-05-09 US claimed
EP-4162100-A1 SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME MacDermid Enthone Inc. (US) 2023-04-12 EP claimed
CN-115605635-A Silver/tin electroplating bath and method of use 麦克德米德乐思公司(US) 2023-01-13 CN claimed
US-20220170172-A1 Silver/Tin Electroplating Bath and Method of Using the Same MACDERMID ENTHONE INC (US) 2022-06-02 US claimed
US-11280014-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2022-03-22 US claimed
US-20210381121-A1 Silver/Tin Electroplating Bath and Method of Using the Same MACDERMID ENTHONE INC. 2021-12-09 US claimed
US-10889907-B2 Cyanide-free acidic matte silver electroplating compositions and methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2021-01-12 US claimed
EP-3004429-B1 ELECTROPLATING BATHS OF SILVER AND TIN ALLOYS ROHM & HAAS ELECT MAT (US) 2018-07-18 EP claimed
EP-3816325-B1 ACIDIC AQUEOUS SILVER-NICKEL ALLOY ELECTROPLATING COMPOSITIONS AND METHODS DUPONT ELECTRONIC MAT INTERNATIONAL LLC (US) 2025-05-07 EP disclosed
CN-112663101-B Acidic aqueous silver-nickel alloy electroplating compositions and methods 罗门哈斯电子材料有限责任公司 2024-09-20 CN disclosed
US-11643742-B2 Silver/tin electroplating bath and method of using the same MACDERMID ENTHONE INC. (US) 2023-05-09 US disclosed
EP-4162100-A1 SILVER/TIN ELECTROPLATING BATH AND METHOD OF USING THE SAME MacDermid Enthone Inc. (US) 2023-04-12 EP disclosed
CN-115605635-A Silver/tin electroplating bath and method of use 麦克德米德乐思公司(US) 2023-01-13 CN disclosed
EP-4098778-A1 ACIDIC AQUEOUS BINARY SILVER-BISMUTH ALLOY ELECTROPLATING COMPOSITIONS AND METHODS Rohm and Haas Electronic Materials LLC (US) 2022-12-07 EP disclosed
EP-2221396-A1 Lead-Free Tin Alloy Electroplating Compositions and Methods Rohm and Haas Electronic Materials LLC (US) 2010-08-25 EP disclosed
US-20060155093-A1 Polyol compound, transparent molded article and method of manufacturing transparent molded article HOYA CORPORATION (JP) 2006-07-13 US disclosed
EP-1640394-A1 POLYOL COMPOUND, TRANSPARENT MOLDED OBJECTS, AND PROCESS FOR PRODUCING TRANSPARENT MOLDED OBJECT HOYA CORPORATION (JP) 2006-03-29 EP disclosed
US-5162585-A Preparation of dihydroxy bis-sulfides PHILLIPS PETROLEUM COMPANY (US) 1992-11-10 US disclosed
EP-0460300-A1 Process for the preparation of a presulphided catalyst; Process for the preparation of a sulphided catalyst, and use of said catalyst Akzo Nobel N.V. (NL) 1991-12-11 EP disclosed
US-5017535-A Process for the preparation of a presulfided and sulfided catalyst AKZO N.V. (NL) 1991-05-21 US disclosed