⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Formaldehyde SCHEMBL9900398 | 0.91 | — | — | |
| SCHEMBL2057952 | 0.84 | — | — | |
| SCHEMBL2058392 | 0.80 | — | — | |
| SCHEMBL2058579 | 0.76 | ALDH1A1 (0.33) | — | |
| SCHEMBL5570792 | 0.74 | — | — | |
| SCHEMBL1145187 | 0.73 | MAPT (0.40) | — | |
| SCHEMBL1009051 | 0.71 | — | — | |
| SCHEMBL2058493 | 0.71 | ALDH1A1 (0.33) | — | |
| SCHEMBL11800317 | 0.69 | ADRA1A (0.43) | — | |
| SCHEMBL15285926 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7968507-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | claimed |
| US-20090084406-A1 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. | 2009-04-02 | — | — | US | claimed |
| CN-111205691-B | Aluminum-containing coating composition for automobile ball joint assembly and application thereof | 绍兴顺泰机械科技有限公司 | 2021-09-10 | — | — | CN | disclosed |
| CN-111303721-B | Aluminum-containing coating and preparation method thereof | 绍兴顺泰机械科技有限公司 | 2021-09-10 | — | — | CN | disclosed |
| CN-111205692-B | Magnesium-containing coating and preparation method thereof | 绍兴顺泰机械科技有限公司 | 2021-09-10 | — | — | CN | disclosed |
| CN-111303720-B | Zinc-containing coating composition for automobile ball joint assembly and application thereof | 绍兴顺泰机械科技有限公司 | 2021-09-10 | — | — | CN | disclosed |
| CN-111205724-B | Magnesium-containing coating composition for automobile ball joint assembly and application thereof | 绍兴顺泰机械科技有限公司 | 2021-09-10 | — | — | CN | disclosed |
| CN-111303720-A | Zinc-containing coating composition for automobile ball joint assembly and application thereof | 绍兴顺泰机械科技有限公司 | 2020-06-19 | — | — | CN | disclosed |
| CN-111299096-A | Zinc-containing coating and preparation method thereof | 绍兴顺泰机械科技有限公司 | 2020-06-19 | — | — | CN | disclosed |
| CN-111303721-A | Aluminum-containing coating and preparation method thereof | 绍兴顺泰机械科技有限公司 | 2020-06-19 | — | — | CN | disclosed |
| CN-111205724-A | Magnesium-containing coating composition for automobile ball joint assembly and application thereof | 绍兴顺泰机械科技有限公司 | 2020-05-29 | — | — | CN | disclosed |
| CN-105813850-A | Laser markable laminates and documents | 爱克发-格法特公司 | 2016-07-27 | — | — | CN | disclosed |
| US-8163095-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-04-24 | — | — | US | disclosed |
| US-20110206829-A1 | COMPOSITION FOR STRIPPING AND STRIPPING METHOD | SAMSUNG DISPLAY CO., LTD. (KR) | 2011-08-25 | — | — | US | disclosed |
| US-7968507-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | disclosed |
| US-20090084406-A1 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. | 2009-04-02 | — | — | US | disclosed |
| US-6815150-B2 | MIXTURE OF ALKANOLAMINE, SOLVENT, PHOSPHOROUS COMPOUND, OXYACID AND WATER | SHARP KABUSHIKI KAISHA (JP) | 2004-11-09 | — | — | US | disclosed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | disclosed |
| US-20030152874-A1 | Photoresist stripping composition and process for stripping resist | MITSUBISHI GAS CHEMICAL COMPANY INC. (JP) | 2003-08-14 | — | — | US | disclosed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | disclosed |