Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL18039121 | 0.81 | ALDH1A1 (0.38) | TSHR | |
| Thiocyanic Acid SCHEMBL28174693 | 0.79 | TSHR (0.39) | TSHRTRPA1 | |
| Cyanamide SCHEMBL9930186 | 0.79 | TSHR (0.39) | TSHRTRPA1 | |
| Benzene SCHEMBL28207368 | 0.78 | ALDH1A1 (0.40) | TSHR | |
| SCHEMBL26674 | 0.78 | ALDH1A1 (0.40) | TSHR | |
| SCHEMBL28748541 | 0.78 | ALDH1A1 (0.40) | TSHR | |
| SCHEMBL6858490 | 0.75 | TSHR (0.36) | TSHRTRPA1 | |
| Hydrochloric Acid SCHEMBL8028044 | 0.74 | ALDH1A1 (0.38) | TSHR | |
| Fluoride SCHEMBL3304552 | 0.74 | ALDH1A1 (0.38) | TSHR | |
| Phosphine SCHEMBL20701190 | 0.74 | ALDH1A1 (0.38) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024080256-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2024-04-18 | — | — | WO | disclosed |
| WO-2024080255-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 株式会社レゾナック | 2024-04-18 | — | — | WO | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20240064895-A1 | CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR | DENKA COMPANY LIMITED (JP) | 2024-02-22 | — | — | US | disclosed |
| US-11901249-B2 | Curable composition and cured product thereof | DIC CORPORATION (JP) | 2024-02-13 | — | — | US | disclosed |
| US-11873356-B2 | Curable composition and cured product thereof | DIC CORPORATION (JP) | 2024-01-16 | — | — | US | disclosed |
| EP-3971229-B1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO LTD (JP) | 2024-01-03 | — | — | EP | disclosed |
| EP-4299550-A1 | METHOD FOR MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD | Denka Company Limited (JP) | 2024-01-03 | — | — | EP | disclosed |
| WO-2023190575-A1 | CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD | デンカ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023074258-A1 | ACTIVE ESTER COMPOUND | 東洋紡株式会社 | 2023-05-04 | — | — | WO | disclosed |
| WO-2019176554-A1 | UNDERFILL MATERIAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME | デクセリアルズ株式会社 | 2019-09-19 | — | — | WO | disclosed |
| WO-2019163703-A1 | POLYIMIDE PRECURSOR RESIN COMPOSITION | ＪＸＴＧエネルギー株式会社 | 2019-08-29 | — | — | WO | disclosed |
| US-10364372-B2 | Composition and method of producing siliceous film | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-07-30 | — | — | US | disclosed |
| US-20180201807-A1 | COMPOSITION AND METHOD OF PRODUCING SILICEOUS FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-19 | — | — | US | disclosed |
| US-20180187010-A1 | SILICON-CONTAINING RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-07-05 | — | — | US | disclosed |
| EP-3318606-A1 | SILICON-CONTAINING RESIN COMPOSITION | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2018-05-09 | — | — | EP | disclosed |
| US-20130127071-A1 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME | NITTO DENKO CORPORATION (JP) | 2013-05-23 | — | — | US | disclosed |
| EP-2594596-A1 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | NITTO DENKO CORPORATION (JP) | 2013-05-22 | — | — | EP | disclosed |
| US-20120153512-A1 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE OBTAINED USING THE SAME | NITTO DENKO CORPORATION (JP) | 2012-06-21 | — | — | US | disclosed |
| JP-2012017414-A | CURING ACCELERATOR FOR EPOXY RESIN AND EPOXY RESIN-BASED COMPOSITION | HOKKO CHEM IND CO LTD | 2012-01-26 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20180187010-A1 | SILICON-CONTAINING RESIN COMPOSITION | CROCC, SRI, SEM1 | TSHR 4701/4885TRPA1 1599/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.