SCHEMBL20640474

SCHEMBL20640474

CNc1ccc(-c2cccc3c2Cc2ccccc2-3)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 3/20 0.45
NPC1 O15118 2/20 0.45
PNMT P11086 1/20 0.44
CYP1A2 P05177 2/20 0.39
HTR2B P41595 2/20 0.39
ADRA2A P08913 1/20 0.39
MAOA P21397 1/20 0.39
SLC6A2 P23975 1/20 0.39
HTR2C P28335 1/20 0.39
SLC6A4 P31645 1/20 0.39
TSHR P16473 1/20 0.38
CYP3A4 P08684 1/20 0.37
MAPT P10636 1/20 0.36
HPGD P15428 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
HSD17B10 Q99714 1/20 0.36
HTR7 P34969 1/20 0.36
CNR1 P21554 1/20 0.36
ROCK2 O75116 1/20 0.35
PRCP P42785 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8981606 0.86 PGR (0.41) RAB9ANPC1PNMTCYP1A2HTR2B
SCHEMBL21753906 0.83 TDP1 (0.43) RAB9ANPC1PNMTCYP1A2HTR2B
SCHEMBL20640482 0.83 PNMT (0.44) RAB9ANPC1PNMTCYP1A2HTR2B
SCHEMBL19001984 0.82 PNMT (0.42) RAB9ANPC1PNMTCYP1A2HTR2B
SCHEMBL21358352 0.81 PNMT (0.47) RAB9ANPC1PNMTHTR2BMAOA
SCHEMBL28928665 0.80 PNMT (0.50) RAB9ANPC1PNMTHTR2BHTR7
SCHEMBL21753915 0.80 PNMT (0.42) RAB9ANPC1PNMTCYP1A2HTR2B
SCHEMBL70992 0.80 PNMT (0.53) RAB9ANPC1PNMTHTR2BHTR7
SCHEMBL29809707 0.80 PNMT (0.53) RAB9ANPC1PNMTHTR2BHTR7
SCHEMBL29401802 0.80 PNMT (0.53) RAB9ANPC1PNMTHTR2BHTR7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101126003-A Moisture-heat-proof epoxy adhesive UNIV HARBIN ENG (CN) 2008-02-20 CN claimed
CN-111295407-B Resin composition and resin infusion method 塞特工业公司 2023-06-27 CN disclosed
CN-110114384-B Curable composition 3M创新有限公司 2022-06-07 CN disclosed
CN-113165147-A Fast curing bonded abrasive article precursor 3M创新有限公司 2021-07-23 CN disclosed
CN-112543783-A Prepreg 东丽株式会社 2021-03-23 CN disclosed
CN-112313262-A Curable compositions and related methods 3M创新有限公司 2021-02-02 CN disclosed
CN-111295407-A Resin composition and resin infusion method 塞特工业公司 2020-06-16 CN disclosed
EP-3652244-A1 RESIN COMPOSITION Hexcel Composites Limited (GB) 2020-05-20 EP disclosed
CN-110997748-A Curable composition comprising an epoxy resin and a curable solid filler 3M创新有限公司 2020-04-10 CN disclosed
CN-110914355-A Resin composition 赫克塞尔合成有限公司 2020-03-24 CN disclosed
WO-2020040200-A1 PREPREG 東レ株式会社 2020-02-27 WO disclosed
WO-2019011982-A1 RESIN COMPOSITION HEXCEL COMPOSITES LIMITED (GB) 2019-01-17 WO disclosed
CN-109021982-A Liquid crystal alignment agent, manufacturing method of liquid crystal alignment film and liquid crystal display assembly 奇美实业股份有限公司 2018-12-18 CN disclosed
CN-100569885-C Moisture-heat-proof epoxy adhesive UNIV HARBIN ENG (CN) 2009-12-16 CN disclosed
CN-101126003-A Moisture-heat-proof epoxy adhesive UNIV HARBIN ENG (CN) 2008-02-20 CN disclosed