SCHEMBL20734692

SCHEMBL20734692

Cc1cc(C2=CCC(c3ccc(OC#N)cc3)CC2)ccc1OC#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20734709 0.87 MEN1 (0.33)
SCHEMBL2720921 0.76 MCHR1 (0.39)
SCHEMBL2717657 0.75 ALDH1A1 (0.40)
SCHEMBL2718333 0.75 TLR8 (0.39)
SCHEMBL22016853 0.74 MCHR1 (0.39)
SCHEMBL28961560 0.74 PRKAB2 (0.34)
SCHEMBL2718811 0.74 TLR8 (0.42)
SCHEMBL12769090 0.74 ALDH1A1 (0.41)
SCHEMBL2717688 0.73 TLR8 (0.42)
SCHEMBL2824303 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2019031178-A1 RESIN COMPOSITION, CURED PRODUCT, SINGLE-LAYER RESIN SHEET, LAMINATED RESIN SHEET, PREPREG, METAL-FOILED LAMINATE SHEET, PRINTED CIRCUIT BOARD, SEALING MATERIAL, FIBER REINFORCED COMPOSITE MATERIAL, AND ADHESIVE AGENT 三菱瓦斯化学株式会社 2019-02-14 WO disclosed