SCHEMBL207474

SCHEMBL207474

CCCCCCCCCCCCCCCCCC(=O)OCCSC(C)C(CCCCCc1cc(C)c(O)c(C(C)(C)C)c1)C(=O)O

nearest known ligand 0.41

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CNR2 P34972 15/20 0.41
CNR1 P21554 11/20 0.39
DGKA P23743 1/20 0.36
VCAM1 P19320 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL207475 0.88 CNR2 (0.41) CNR2CNR1DGKAVCAM1
SCHEMBL2850294 0.86 CNR2 (0.42) CNR2CNR1DGKA
SCHEMBL206939 0.86 CNR2 (0.45) CNR2CNR1DGKA
SCHEMBL207476 0.85 CNR2 (0.46) CNR2CNR1DGKA
SCHEMBL206940 0.85 CNR2 (0.50) CNR2CNR1DGKA
SCHEMBL206938 0.85 CNR2 (0.42) CNR2CNR1VCAM1
SCHEMBL8999383 0.83 CNR2 (0.51) CNR2CNR1DGKA
SCHEMBL11672695 0.82 DGKA (0.43) CNR2CNR1DGKAVCAM1
SCHEMBL11614000 0.82 CNR2 (0.48) CNR2CNR1DGKA
SCHEMBL15008804 0.81 CNR2 (0.42) CNR2CNR1DGKA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109860-A1 HEAT-CURABLE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-23 US disclosed
EP-4729563-A1 HEAT-CURABLE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD., (JP) 2026-04-22 EP disclosed
US-20250388747-A1 EPOXY RESIN COMPOSITION SHINETSU CHEMICAL CO (JP) 2025-12-25 US disclosed
EP-4667522-A1 EPOXY RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250084205-A1 RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-03-13 US disclosed
US-12146057-B2 Cyclic imide resin composition, prepreg, copper-clad laminate and printed-wiring board SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-11-19 US disclosed
US-12110356-B2 Heat-curable resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-10-08 US disclosed
US-20230130867-A1 CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COPPER-CLAD LAMINATE AND PRINTED-WIRING BOARD SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 US disclosed
US-11608438-B2 Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-03-21 US disclosed
US-20230067259-A1 HEAT-CURABLE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-03-02 US disclosed
US-20080043176-A1 Method of Manufacturing a Polarizing Plate Protective Film, Polarizing Plate Protective Film, Polarizing Plate, and Liquid Crystal Display Device KONICA MINOLTA OPTO, INC. (JP) 2008-02-21 US disclosed
US-20080023881-A1 Method of manufacturing optical film, optical film, polarization plate and image display apparatus using these KONICA MINOLTA OPTO, INC. (JP) 2008-01-31 US disclosed
US-20080013173-A1 METHOD OF MANUFACTURING A POLARIZING PLATE PROTECTIVE FILM, POLARIZING PLATE PROTECTIVE FILM, POLARIZING PLATE, AND LIQUID CRYSTAL DISPLAY DEVICE KONICA MINOLTA OPTO, INC. (JP) 2008-01-17 US disclosed
US-20070252293-A1 METHOD FOR MANUFACTURING AN OPTICAL FILM HAVING A CONVEXOCONCAVE STRUCTURE, OPTICAL FILM, WIRE GRID POLARIZER AND RETARDATION FILM KONICA MINOLTA OPTO, INC. (JP) 2007-11-01 US disclosed
US-20070254115-A1 Polarizer protective film, manufacturing method thereof, polarizing plate and liquid crystal display KONICA MINOLTA OPTO, INC. (JP) 2007-11-01 US disclosed
US-20070227652-A1 FILM FOR DISPLAY, POLARIZING PLATE AND MANUFACTURING METHOD THEREOF, AND LIQUID CRYSTAL DISPLAY KONICA MINOLTA OPTO, INC. (JP) 2007-10-04 US disclosed
US-20060233973-A1 Cellulose ester film, manufacturing method thereof, optical film, polarizing plate and liquid crystal display KONICA MINOLTA OPTO, INC. 2006-10-19 US disclosed
US-20040167255-A1 Stabilizer composition EVERLIGHT USA, INC. 2004-08-26 US disclosed
CN-1517392-A Composition stabilizer 美国永光公司 2004-08-04 CN disclosed
EP-1439206-A2 Stabilizer composition Everlight USA, Inc. (US) 2004-07-21 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250388747-A1 EPOXY RESIN COMPOSITION EED, ELL, EPCAM CNR2 3399/4885CNR1 3859/4885DGKA 2979/4885
US-20260109860-A1 HEAT-CURABLE RESIN COMPOSITION RAD51, COL2A1, SEM1 CNR2 2144/4885CNR1 2364/4885DGKA 3474/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.