Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KCNH2 | Q12809 | 2/20 | 0.36 |
| ▸ | SIGMAR1 | Q99720 | 4/20 | 0.35 |
| ▸ | EPHX1 | P07099 | 3/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 1/20 | 0.35 |
| ▸ | KCNH3 | Q9ULD8 | 1/20 | 0.35 |
| ▸ | HDAC8 | Q9BY41 | 5/20 | 0.34 |
| ▸ | HDAC3 | O15379 | 3/20 | 0.34 |
| ▸ | HDAC6 | Q9UBN7 | 3/20 | 0.34 |
| ▸ | CACNA2D1 | P54289 | 2/20 | 0.34 |
| ▸ | HDAC1 | Q13547 | 2/20 | 0.34 |
| ▸ | HDAC2 | Q92769 | 2/20 | 0.34 |
| ▸ | CNR2 | P34972 | 1/20 | 0.34 |
| ▸ | HDAC4 | P56524 | 1/20 | 0.34 |
| ▸ | HDAC7 | Q8WUI4 | 1/20 | 0.34 |
| ▸ | HDAC10 | Q969S8 | 1/20 | 0.34 |
| ▸ | HDAC11 | Q96DB2 | 1/20 | 0.34 |
| ▸ | HDAC9 | Q9UKV0 | 1/20 | 0.34 |
| ▸ | HDAC5 | Q9UQL6 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18896255 | 0.84 | TDP1 (0.45) | KCNH2EPHX1ALDH1A1HTTKCNH3 | |
| SCHEMBL5875341 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL4688472 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL19271855 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL25124425 | 0.83 | ENPP2 (0.43) | KCNH2EPHX1ALDH1A1HTTKCNH3 | |
| SCHEMBL23861793 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL20987622 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL21499101 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL28681232 | 0.83 | HDAC8 (0.44) | EPHX1ALDH1A1HTTHDAC8HDAC3 | |
| SCHEMBL5130052 | 0.82 | ALDH1A1 (0.35) | ALDH1A1HTTKCNH3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114806145-B | Resin composition | 味之素株式会社 | 2025-05-02 | — | — | CN | claimed |
| CN-114806145-B | Resin composition | 味之素株式会社 | 2025-05-02 | — | — | CN | disclosed |
| WO-2025089080-A1 | RESIN COMPOSITION, HEAT DISSIPATION DEVICE, AND ELECTRONIC DEVICE | ＡＧＣ株式会社 | 2025-05-01 | — | — | WO | disclosed |
| CN-119585335-A | Resin composition | 味之素株式会社 | 2025-03-07 | — | — | CN | disclosed |
| US-20250022829-A1 | UNDERFILL MATERIAL | AJINOMOTO CO., INC. (JP) | 2025-01-16 | — | — | US | disclosed |
| EP-4475179-A1 | UNDERFILL MATERIAL | AJINOMOTO CO., INC. (JP) | 2024-12-11 | — | — | EP | disclosed |
| CN-110018613-B | Resin composition | 味之素株式会社 | 2024-11-05 | — | — | CN | disclosed |
| CN-118648100-A | Underfill material | 味之素株式会社 | 2024-09-13 | — | — | CN | disclosed |
| CN-110035622-B | Method for manufacturing printed wiring board | 味之素株式会社 | 2024-09-10 | — | — | CN | disclosed |
| CN-118496658-A | Resin sheet | 味之素株式会社 | 2024-08-16 | — | — | CN | disclosed |
| WO-2023149210-A1 | UNDERFILL MATERIAL | 味の素株式会社 | 2023-08-10 | — | — | WO | disclosed |
| CN-116540492-A | Photosensitive resin composition | 味之素株式会社 | 2023-08-04 | — | — | CN | disclosed |
| CN-109233212-B | Resin composition | 味之素株式会社 | 2023-03-31 | — | — | CN | disclosed |
| CN-114806145-A | Resin composition | 味之素株式会社 | 2022-07-29 | — | — | CN | disclosed |
| CN-108624218-B | Resin composition | 味之素株式会社 | 2022-03-29 | — | — | CN | disclosed |
| US-10808103-B2 | Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-10-20 | — | — | US | disclosed |
| EP-3466992-B1 | RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL CO (JP) | 2020-07-08 | — | — | EP | disclosed |
| CN-111349314-A | Resin composition | 味之素株式会社 | 2020-06-30 | — | — | CN | disclosed |
| US-20190300678-A1 | RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-10-03 | — | — | US | disclosed |
| EP-3466992-A1 | RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE | Mitsubishi Gas Chemical Company, Inc. (JP) | 2019-04-10 | — | — | EP | disclosed |