SCHEMBL209602

SCHEMBL209602

CCCCO[Si](C)(CCCSSCCC[Si](C)(OCCCC)OCCCC)OCCCC

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ADRB2 P07550 1/20 0.31
ADRB1 P08588 1/20 0.31
ADRB3 P13945 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL210132 0.92
SCHEMBL15023939 0.88 PLA2G4B (0.32) ADRB2ADRB1ADRB3
SCHEMBL706695 0.84 ADRB2 (0.38) ADRB2ADRB1ADRB3
SCHEMBL705364 0.84 ADRB2 (0.38) ADRB2ADRB1ADRB3
SCHEMBL9990832 0.84
SCHEMBL703594 0.82 ADRB2 (0.39) ADRB2ADRB1ADRB3
SCHEMBL23526501 0.81
SCHEMBL209438 0.81 ADRB2 (0.32) ADRB2ADRB1ADRB3
SCHEMBL108779 0.80
SCHEMBL11332073 0.80 THRB (0.38) ADRB2ADRB1ADRB3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8853312-B2 Resin composition and semiconductor device produced by using the same SUMITOMO BAKELITE CO., LTD (JP) 2014-10-07 US disclosed
US-8754178-B2 Resin composition and semiconductor device produced using resin composition SUMITOMO BAKELITE CO., LTD. (JP) 2014-06-17 US disclosed
EP-1736520-B1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME SUMITOMO BAKELITE CO (JP) 2014-04-30 EP disclosed
US-8614270-B2 Resin composition and semiconductor device produced by using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2013-12-24 US disclosed
EP-2647686-A2 Resin Composition And Semiconductor Device Produced By Using The Same SUMITOMO BAKELITE CO., LTD. (JP) 2013-10-09 EP disclosed
EP-2615122-A1 RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION Sumitomo Bakelite Co., Ltd. (JP) 2013-07-17 EP disclosed
US-20130158188-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION SUMITOMO BAKELITE CO., LTD. (JP) 2013-06-20 US disclosed
US-20130109798-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME SUMITOMO BAKELITE CO., LTD. (JP) 2013-05-02 US disclosed
US-20120068106-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-03-22 US disclosed
US-8088308-B2 Resin composition and semiconductor device produced by using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-01-03 US disclosed
US-7371480-B2 Silica sol composition, membrane electrode assembly with proton-exchange membrane, and fuel cell FUJIFILM CORPORATION (JP) 2008-05-13 US disclosed
US-20070213467-A1 Resin Composition and Semiconductor Device Produced By Using the Same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-09-13 US disclosed
EP-1736520-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Ltd. (JP) 2006-12-27 EP disclosed