Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | USP2 | O75604 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | BLM | P54132 | 1/20 | 0.39 |
| ▸ | CACNA2D1 | P54289 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methacrylic Acid SCHEMBL194143 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL4128851 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL128831 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL149902 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL4129350 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL1019402 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL3699952 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL11905901 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL130200 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR | |
| Methacrylic Acid SCHEMBL2138972 | 1.00 | CYP1A2 (0.39) | CYP1A2ALDH1A1USP2LMNATSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 299 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105273124-B | Molding material for forming photofabrication pattern in inkjet stereolithography and method for manufacturing photofabrication pattern | 株式会社其恩斯 | 2021-01-19 | — | — | CN | claimed |
| US-10195133-B2 | Photocurable composition for nail or artificial nail | THREE BOND CO., LTD. | 2019-02-05 | — | — | US | claimed |
| US-10040967-B2 | Photosensitive film, photosensitive element, cured product and touch panel | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-08-07 | — | — | US | claimed |
| US-20180215850-A1 | PHOTOCURABLE RESIN COMPOSITION AND METHOD OF FORMING PATTERNS USING THE SAME | CHEM OPTICS INC. (KR) | 2018-08-02 | — | — | US | claimed |
| US-8163835-B2 | Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2012-04-24 | — | — | US | claimed |
| US-7829605-B2 | Energy ray-curable resin composition and adhesive using same | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2010-11-09 | — | — | US | claimed |
| WO-2010021476-A2 | PHOTOPOLYMERIZABLE OLIGOMER, PHOTOPOLYMERIZABLE RESIN COMPOSITION CONTAINING THE SAME, AND OPTICAL FIBER | 에스에스씨피 주식회사 (KR) | 2010-02-25 | — | — | WO | claimed |
| US-20090078747-A1 | Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods | KUKDO ADVANCED MATERIALS CO., LTD. (KR) | 2009-03-26 | — | — | US | claimed |
| US-20090030107-A1 | ENERGY RAY-CURABLE RESIN COMPOSITION AND ADHESIVE USING SAME | DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) | 2009-01-29 | — | — | US | claimed |
| WO-2024150700-A1 | RESIN COMPOSITION, CURED ARTICLE, MULTILAYER BODY, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2024-07-18 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143183-A1 | RESIN COMPOSITION AND CURED PRODUCT | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| US-5977276-A | High index/high Abbe number composition | SOLA INTERNATIONAL HOLDINGS LTD. (AU) | 1999-11-02 | — | — | US | disclosed |
| US-5908899-A | RUBBER-MODIFIED UNSATURATED COMPOUND OBTAINED BY GRAFTING A MONOMER HAVING AT LEAST ONE POLYMERIZABLE ETHYLENICALLY UNSATURATED BOND IN A MOLECULE WITH AT LEAST ONE RUBBER; A COUPLING AGENT, A FILLER AND A PHOTOPOLYMERIZATION INITIATOR. | MITSUI CHEMICALS, INC. (JP) | 1999-06-01 | — | — | US | disclosed |
| EP-0828766-A4 | — | — | 1998-04-22 | — | — | EP | disclosed |
| EP-0828766-A1 | HIGH INDEX/HIGH ABBE NUMBER COMPOSITION | SOLA INTERNATIONAL HOLDINGS, LTD. (AU) | 1998-03-18 | — | — | EP | disclosed |
| EP-0781809-A2 | Resin composition for sealing liquid crystal cells | MITSUI TOATSU CHEMICALS, INC. (JP) | 1997-07-02 | — | — | EP | disclosed |
| WO-1996038486-A1 | HIGH INDEX/HIGH ABBE NUMBER COMPOSITION | SOLA INTERNATIONAL HOLDINGS LTD. (AU) | 1996-12-05 | — | — | WO | disclosed |