SCHEMBL2102171

SCHEMBL2102171

CCNCNc1ccccc1C([SiH3])CC

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2267117 0.86 IDO1 (0.38) TSHR
SCHEMBL2267572 0.77 L3MBTL1 (0.38) TSHR
SCHEMBL2100484 0.75 CACNA2D1 (0.33) TSHR
SCHEMBL9233119 0.73 TSHR (0.44) TSHR
SCHEMBL2103331 0.73 MAPT (0.33)
SCHEMBL2102973 0.71 MEN1 (0.34) TSHR
SCHEMBL28745215 0.67 IDO1 (0.40) TSHR
SCHEMBL2101112 0.67 KDM4E (0.34)
SCHEMBL28391746 0.66 ESR1 (0.46) TSHR
SCHEMBL4961331 0.66 L3MBTL1 (0.52) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed