SCHEMBL2102184

SCHEMBL2102184

CCCCC=C[SiH2]NCNCC

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.33
FAAH O00519 2/20 0.32
TRPV1 Q8NER1 1/20 0.32
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2275813 0.84 TSHR (0.33) TSHRFAAHTRPV1ALDH1A1
SCHEMBL2101789 0.72
SCHEMBL2102579 0.68
SCHEMBL2101779 0.68
SCHEMBL2100604 0.67
SCHEMBL5968654 0.67 TSHR (0.41) TSHRFAAHTRPV1ALDH1A1
SCHEMBL5968664 0.67 TSHR (0.41) TSHRFAAHTRPV1ALDH1A1
SCHEMBL2100759 0.65 DNM1 (0.32) TSHRALDH1A1
SCHEMBL2268141 0.63
SCHEMBL8650471 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-8164166-B2 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2012-04-24 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed
US-20090085170-A1 INTERFACIAL ROUGHNESS REDUCING FILM, WIRING LAYER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2009-04-02 US disclosed